SFFSAD6A April   2025  – September 2025 TPSM33606-Q1 , TPSM33610-Q1 , TPSM33620-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

1 Overview

This document contains information for the TPSM336xx-Q1 (QFN-HR package) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

TPSM336xx-Q1 TPSM33620-Q1 TPSM33610-Q1 TPSM33606-Q1 Functional Block Diagram Figure 1-1 Functional Block Diagram

The TPSM336xx-Q1 were developed using a quality-managed development process, but were not developed in accordance with the IEC 61508 or ISO 26262 standards.

ADVANCE INFORMATION for preproduction products; subject to change without notice.