SFFSBP7 November   2026 TPS1HTC100-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
  7. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TPS1HTC100-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:
  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)
Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.
Table 4-1 TI Classification of Failure Effects
Class Failure Effects
A Potential device damage that affects functionality.
B No device damage, but loss of functionality.
C No device damage, but performance degradation.
D No device damage, no impact to functionality or performance.
Figure 4-1 shows the TPS1HTC100-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TPS1HTC100-Q1 datasheet.
TPS1HTC100-Q1 Pin Diagram Figure 4-1 Pin Diagram
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
  • The user follows the datasheet recommendations for operating conditions, external components selection, and PCB layout.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
GND 1 The resistor diode network is bypassed if present. B
EN 2 There is a shutdown of the output. B
DIAG_EN 3 The diagnostics are disabled. B
FAULT 4 The reported status can be erroneous. B
LATCH 5 The device defaults to auto-retry (automatic) mode when encountering a thermal fault. B
SNS 6 The sense current is not valid from the SNS pin. B
ILIM 7 The device defaults to the internal current limit. C
NC 11 There is no effect on the device. D
VOUT 8, 9, 10 The current limit of the device engages. B
VS 12, 13, 14 The device has no input supply, and therefore, does not function. B
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
GND 1 Loss of ground detection engages, and the device shuts off. B
EN 2 The output is shutdown, and the EN pin is pulled down internally. B
DIAG_EN 3 DIAG_EN is internally pulled down. The diagnostics are disabled. B
FAULT 4 The fault signal is not reported. B
LATCH 13 LATCH is internally pulled down. The device defaults to auto-retry mode when encountering a thermal fault. B
SNS 10 The correct sense current cannot be read. B
ILIM 11 The device defaults to the internal current limit. C
NC 11 There is no effect on the device. D
VOUT 8, 9, 10 There is no effect on the device. If configured, open load detection triggers. B
VS 12, 13, 14 The device has no input supply, and therefore, does not function. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effects Failure Effect Class
GND 1 EN The channel is disabled. B
EN 2 DIAG_EN The EN signal effects the DIAG_EN signal and vice versa. B
DIAG_EN 3 FAULT Fault reporting is erroneous. The diagnostics are enabled if FAULT is pulled high. B
FAULT 4 LATCH Fault reporting is erroneous. The device is in auto-retry mode if FAULT is pulled high. B
LATCH 5 SNS The current sensing output is erroneous. The device is in auto-retry or latched off depending on the output of the SNS pin. B
SNS 6 ILIM The current limit and current sensing output are incorrect. B
VOUT 10 NC There is no effect on the device. D
NC 11 VS There is no effect on the device. D
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply (VS)
Pin Name Pin No. Description of Potential Failure Effects Failure Effect Class
GND 1 The supply power is bypassed, and the device does not turn on. B
EN 2 There is a potential violation of the absolute maximum rating of pin, and a possible breakdown of the ESD cell. A
DIAG_EN 3 There is a potential violation of the absolute maximum rating of pin, and a possible breakdown of the ESD cell. A
FAULT 4 There is a potential violation of the absolute maximum rating of pin, and a possible breakdown of the ESD cell.. A
LATCH 5 There is a potential violation of the absolute maximum rating of pin, and a possible breakdown of the ESD cell. A
SNS 6 There is a potential violation of the absolute maximum rating of pin, and a possible breakdown of the ESD cell. A
ILIM 7 There is a potential violation of the absolute maximum rating of pin, and a possible breakdown of the ESD cell. A
NC 11 There is no effect on the device. D
VOUT 8, 9, 10 The output is pulled to the supply voltage. Short-to-battery detection is triggered if configured. B