SGLS183C August   2003  – July 2025 UCC2808A-1Q1 , UCC2808A-2Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configurations and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Pin Descriptions
        1. 7.3.1.1 COMP Pin
        2. 7.3.1.2 OUTA and OUTB Pins
        3. 7.3.1.3 RC Pin
        4. 7.3.1.4 VDD Pin
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC
      2. 7.4.2 Push-Pull or Half-Bridge Function
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Device Comparison Table

Device Comparison

TA UVLO OPTION PACKAGE(1) ORDERABLE PART NUMBER(2) TOP-SIDE MARKING
–40°C to 125°C 12.5V/8.3V D (SOIC, 8) Tape and reel UCC2808AQDR-1Q1 2D08-1
–40°C to 125°C 4.3V/4.1V D (SOIC, 8) Tape and reel UCC2808AQDR-2Q1 2D08-2
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see Section 11, or see the TI web site at www.ti.com.