SLCS014B October   1977  – April 2025 LM3302

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage Comparison
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Voltage Range
        2. 7.2.2.2 Minimum Overdrive Voltage
        3. 7.2.2.3 Output and Drive Current
        4. 7.2.2.4 Response Time
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision A (August 2003) to Revision B (April 2025)

  • Updated to current TI data sheet format. No changes to Electrical Table specs.Go
  • Updated ESD table for new packagesGo
  • Updated Thermal Information table for new packagesGo
  • Added Typical GraphsGo
  • Updated Functional Block DiagramGo

Changes from Revision * (October 1977) to Revision A (August 2003)

  • Removed Ceramic 'J' package. Added SOIC ordering optionsGo