SLDA021B March   2014  – February 2020 AM3892 , AM3894

 

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11 Summary

Designing highly reliable systems using flip chip BGA packages is possible with a good understanding of the manufacturing process and the impact of each design element on PCB performance.

For reliability, careful attention should be provided for the physical characteristics of the copper lands on the PCB. Matching the land diameter on the PCB to that on the BGA package ensures a robust solder connection.

In addition to properly designing the PCB, is the following assembly considerations are necessary:

  • Understand the reflow process which best fits your PCB system mounting requirements.
  • Follow the provided reflow profile and compare closely to the solder paste manufacturer’s recommended reflow profile.

On new PCB designs, conduct appropriate strain and strain rate characterization on the PCB assembly process prior to component-mounting.

Avoid excessive shock and bending of the PC board during assembly, handling, and testing of FCBGAs.

Finally, always follow the directions provided for handling moisture-sensitive devices. Keep the required documentation readily available to avoid potential disruptions associated with moisture−induced problems.