SLLSEN0C November   2015  – September 2020 SN65MLVD204B

ADVANCE INFORMATION  

1. 1 Features
2. 2 Applications
3. 3 Description
4. 4 Revision History
5. 5 Pin Configuration and Functions
   1.     Pin Functions
   2.     Pin Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information
   5. 6.5  Electrical Characteristics
   6. 6.6  Electrical Characteristics – Driver
   7. 6.7  Electrical Characteristics – Receiver
   8. 6.8  Electrical Characteristics – BUS Input and Output
   9. 6.9  Switching Characteristics – Driver
   10. 6.10 Switching Characteristics – Receiver
   11. 6.11 Typical Characteristics
7. 7 Parameter Measurement Information
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1 Power-On-Reset
      2. 8.3.2 ESD Protection
   4. 8.4 Device Functional Modes
      1. 8.4.1 Operation with VCC < 1.5 V
      2. 8.4.2 Operations with 1.5 V ≤ VCC < 3 V
      3. 8.4.3 Operation with 3 V ≤ VCC < 3.6 V
      4. 8.4.4 Device Function Tables
      5. 8.4.5 Equivalent Input and Output Schematic Diagrams
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Application
      1. 9.2.1 Multipoint Communications
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
         1. 9.2.3.1  Supply Voltage
         2. 9.2.3.2  Supply Bypass Capacitance
         3. 9.2.3.3  Driver Input Voltage
         4. 9.2.3.4  Driver Output Voltage
         5. 9.2.3.5  Termination Resistors
         6. 9.2.3.6  Receiver Input Signal
         7. 9.2.3.7  Receiver Input Threshold (Failsafe)
         8. 9.2.3.8  Receiver Output Signal
         9. 9.2.3.9  Interconnecting Media
         10. 9.2.3.10 PCB Transmission Lines
      4. 9.2.4 Application Curves
10. 10Power Supply Recommendations
11. 11Layout
    1. 11.1 Layout Guidelines
       1. 11.1.1 Microstrip vs. Stripline Topologies
       2. 11.1.2 Dielectric Type and Board Construction
       3. 11.1.3 Recommended Stack Layout
       4. 11.1.4 Separation Between Traces
       5. 11.1.5 Crosstalk and Ground Bounce Minimization
       6. 11.1.6 Decoupling
    2. 11.2 Layout Example
12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Option Addendum
       1. 13.1.1 Packaging Information
       2. 13.1.2 Tape and Reel Information