SLLSFP4A July   2022  – August 2026 ISOW7721

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics - Power Converter
    10. 5.10 Supply Current Characteristics - Power Converter
    11. 5.11 Electrical Characteristics Channel Isolator - VIO, VISOIN = 5-V
    12. 5.12 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 5-V
    13. 5.13 Electrical Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    14. 5.14 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 3.3-V
    15. 5.15 Electrical Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    16. 5.16 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 2.5-V
    17. 5.17 Electrical Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    18. 5.18 Supply Current Characteristics Channel Isolator - VIO, VISOIN = 1.8-V
    19. 5.19 Switching Characteristics - 5-V Supply
    20. 5.20 Switching Characteristics - 3.3-V Supply
    21. 5.21 Switching Characteristics - 2.5-V Supply
    22. 5.22 Switching Characteristics - 1.8-V Supply
    23. 5.23 Insulation Characteristics Curves
    24. 5.24 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Power Isolation
      2. 7.1.2 Signal Isolation
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
      2. 7.3.2 Power-Up and Power-Down Behavior
      3. 7.3.3 Protection Features
      4. 7.3.4 Multi-Device Chaining for Increased Power Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
        1. 8.2.3.1 Insulation Lifetime
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 PCB Material
      2. 8.4.2 Layout Example
  10. 9 Revision History
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

8.2.1 Design Requirements

To design with this device, use the parameters listed in Table 8-1.

Table 8-1 Design Parameters
PARAMETERVALUE
VDD input voltage3V to 5.5V
VIO input voltage1.71V to 5.5V
VISOIN input voltage1.71V to 5.5V
VDD decoupling capacitors10µF + 1µF + 0.01µF + optional additional capacitance
VIO decoupling capacitors0.1µF + optional additional capacitance
VISOIN decoupling capacitors0.1µF + optional additional capacitance
VISOOUT decoupling capacitors10µF + 1µF + 0.01µF + optional additional capacitance
VISOOUT to VISOIN series inductorBLM15ELX9331SN1D
GND2 to GISOIN series inductorBLM15ELX9331SN1D
VIO series inductorBLM15ELX9331SN1D
VDD series inductorBLM15ELX9331SN1D

Because of very-high current flowing through the ISOW7721VDD and VISOOUT supplies, higher decoupling capacitors typically provide better noise and ripple performance. Although a 10µF capacitor is adequate, higher decoupling capacitors (such as 47µF) on both the VDD and VISOOUT pins to the respective grounds are strongly recommended to achieve the best performance.