SLLSFX4B February   2025  – October 2026 TCAN857-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings, IEC Specification
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Supply Characteristics
    7. 6.7  Dissipation Ratings
    8. 6.8  Electrical Characteristics
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1 TXD
        2. 8.3.1.2 GND
        3. 8.3.1.3 VCC
        4. 8.3.1.4 RXD
        5. 8.3.1.5 VIO
        6. 8.3.1.6 CANH and CANL
        7. 8.3.1.7 S (Silent)
      2. 8.3.2 CAN Bus States
      3. 8.3.3 TXD Dominant Timeout (DTO)
      4. 8.3.4 CAN Bus Short-circuit Current Limiting
      5. 8.3.5 Thermal Shutdown (TSD)
      6. 8.3.6 Undervoltage Lockout
      7. 8.3.7 Unpowered Device
      8. 8.3.8 Floating pins
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operating Modes
      2. 8.4.2 Normal Mode
      3. 8.4.3 Silent Mode
      4. 8.4.4 Driver and Receiver Function
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 CAN Termination
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1 Bus Loading, Length and Number of Nodes
      3. 9.2.3 System Examples
      4. 9.2.4 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.6 Power Supply Characteristics

Over recommended operating conditions with TJ = -40℃ to 150℃ (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Supply current normal mode Dominant TXD = 0V, RL = 60Ω, CL = open 70 mA
TXD = 0V, RL = 50Ω, CL = open 80 mA
Dominant with bus fault TXD = 0V, CANH = CANL = ±25V, RL = open, CL = open 130 mA
Recessive, TCAN857V TXD = VIO, RL = 50Ω, CL = open, RCM = open 10 mA
Recessive, TCAN857 TXD = VCC, RL = 50Ω, CL = open, RCM = open 10 mA
Supply current silent mode TXD = VCC, RL = 50Ω, CL = open 3 mA
IIO I/O supply current normal mode (Devices with VIO) Dominant RXD floating, TXD = 0V 400 µA
Recessive RXD floating, TXD = VIO 150 µA
I/O supply current silent mode (Devices with VIO) RXD floating, TXD = VIO 35 µA
UVVCC Rising under voltage detection on VCC for protected mode 4.2 4.6 V
Falling under voltage detection on VCC for protected mode 3.5 4 4.5 V
UVVIO Rising under voltage detection on VIO 2.5 2.9 V
Falling under voltage detection on VIO 2.1 2.4 V
TSDR Thermal shutdown temperature, rising 160 190
TSDF Thermal shutdown temperature, falling (release) 150 180
TSD(HYS) Thermal shutdown hysteresis 10