SLLSFZ8A November   2025  – March 2026 MCF8329HS-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings Auto
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Three Phase BLDC Gate Drivers
      2. 6.3.2  Gate Drive Architecture
        1. 6.3.2.1 Dead time and Cross Conduction Prevention
      3. 6.3.3  AVDD Linear Voltage Regulator
      4. 6.3.4  Low-Side Current Sense Amplifier
      5. 6.3.5  Device Interface Modes
        1. 6.3.5.1 Interface - Control and Monitoring
        2. 6.3.5.2 I2C Interface
      6. 6.3.6  Motor Control Input Options
        1. 6.3.6.1 Analog-Mode Motor Control
        2. 6.3.6.2 PWM-Mode Motor Control
        3. 6.3.6.3 Frequency-Mode Motor Control
        4. 6.3.6.4 I2C based Motor Control
        5. 6.3.6.5 Input Control Signal Profiles
          1. 6.3.6.5.1 Linear Control Profiles
          2. 6.3.6.5.2 Staircase Control Profiles
          3. 6.3.6.5.3 Forward-Reverse Profiles
          4. 6.3.6.5.4 Multi-Reference Mode Operation
          5. 6.3.6.5.5 Input Reference Transfer Function without Profiler
      7. 6.3.7  Bootstrap Capacitor Initial Charging
      8. 6.3.8  Starting the Motor Under Different Initial Conditions
        1. 6.3.8.1 Case 1 – Motor is Stationary
        2. 6.3.8.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 6.3.8.3 Case 3 – Motor is Spinning in the Reverse Direction
      9. 6.3.9  Motor Start Sequence (MSS)
        1. 6.3.9.1 Initial Speed Detect (ISD)
        2. 6.3.9.2 Motor Resynchronization
        3. 6.3.9.3 Reverse Drive
          1. 6.3.9.3.1 Reverse Drive Tuning
        4. 6.3.9.4 Motor Start-up
          1. 6.3.9.4.1 Align
          2. 6.3.9.4.2 Double Align
          3. 6.3.9.4.3 Initial Position Detection (IPD)
            1. 6.3.9.4.3.1 IPD Operation
            2. 6.3.9.4.3.2 IPD Release
            3. 6.3.9.4.3.3 IPD Advance Angle
          4. 6.3.9.4.4 Slow First Cycle Startup
          5. 6.3.9.4.5 Open Loop
          6. 6.3.9.4.6 Transition from Open to Closed Loop
      10. 6.3.10 Closed Loop Operation
        1. 6.3.10.1 Closed loop accelerate
        2. 6.3.10.2 Speed PI Control
        3. 6.3.10.3 Current PI Control
        4. 6.3.10.4 Overmodulation
        5. 6.3.10.5 Power Loop
        6. 6.3.10.6 Modulation Index Control
        7. 6.3.10.7 Motor Speed Limit
        8. 6.3.10.8 Input DC Power Limit
      11. 6.3.11 Maximum Torque Per Ampere (MTPA) Control
      12. 6.3.12 Flux Weakening Control
      13. 6.3.13 Motor Parameters
        1. 6.3.13.1 Motor Resistance
        2. 6.3.13.2 Motor Inductance
        3. 6.3.13.3 Motor Back-EMF constant
      14. 6.3.14 Motor Parameter Extraction Tool (MPET)
      15. 6.3.15 Single Hall Sensor Operation
      16. 6.3.16 Anti-Voltage Surge (AVS)
      17. 6.3.17 Active Braking
      18. 6.3.18 Output PWM Switching Frequency
      19. 6.3.19 PWM Dithering
      20. 6.3.20 Voltage Sense Scaling
      21. 6.3.21 Motor Stop Options
        1. 6.3.21.1 Coast (Hi-Z) Mode
        2. 6.3.21.2 Low-Side Braking
        3. 6.3.21.3 Active Spin-Down
      22. 6.3.22 FG Configuration
        1. 6.3.22.1 FG Output Frequency
        2. 6.3.22.2 FG in Open-Loop
        3. 6.3.22.3 FG During Motor Stop
        4. 6.3.22.4 FG Behavior During Fault
      23. 6.3.23 Protections
        1. 6.3.23.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 6.3.23.2  AVDD Power on Reset (AVDD_POR)
        3. 6.3.23.3  GVDD Undervoltage Lockout (GVDD_UV)
        4. 6.3.23.4  BST Undervoltage Lockout (BST_UV)
        5. 6.3.23.5  MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 6.3.23.6  VSENSE Overcurrent Protection (SEN_OCP)
        7. 6.3.23.7  Thermal Shutdown (OTSD)
        8. 6.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 6.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 6.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 6.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 110b)
          4. 6.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE = 111b)
        9. 6.3.23.9  Lock Detection Current Limit (LOCK_ILIMIT)
          1. 6.3.23.9.1 LOCK_ILIMIT Latched Shutdown (LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 6.3.23.9.2 LOCK_ILIMIT Automatic Recovery (LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 6.3.23.9.3 LOCK_ILIMIT Report Only (LOCK_ILIMIT_MODE = 110b)
          4. 6.3.23.9.4 LOCK_ILIMIT Disabled (LOCK_ILIMIT_MODE = 111b)
        10. 6.3.23.10 Motor Lock (MTR_LCK)
          1. 6.3.23.10.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xb or 010b)
          2. 6.3.23.10.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE = 011b or 10xb)
          3. 6.3.23.10.3 MTR_LCK Report Only (MTR_LCK_MODE = 110b)
          4. 6.3.23.10.4 MTR_LCK Disabled (MTR_LCK_MODE = 111b)
        11. 6.3.23.11 Motor Lock Detection
          1. 6.3.23.11.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 6.3.23.11.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 6.3.23.11.3 Lock3: No-Motor Fault (NO_MTR)
        12. 6.3.23.12 EEPROM Fault
        13. 6.3.23.13 I2C CRC Fault
        14. 6.3.23.14 Maximum PVDD (Overvoltage) Protection
        15. 6.3.23.15 Minimum PVDD (Undervoltage) Protection
        16. 6.3.23.16 MPET Faults
        17. 6.3.23.17 Dry Run Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Functional Modes
        1. 6.4.1.1 Sleep Mode
        2. 6.4.1.2 Standby Mode
        3. 6.4.1.3 Fault Reset (CLR_FLT)
    5. 6.5 External Interface
      1. 6.5.1 DRVOFF - Gate Driver Shutdown Functionality
      2. 6.5.2 Oscillator Source
        1. 6.5.2.1 Clock (Internal Oscillator) Frequency
      3. 6.5.3 External Watchdog with MCU Reset
    6. 6.6 EEPROM access and I2C interface
      1. 6.6.1 EEPROM Access
        1. 6.6.1.1 EEPROM Write
        2. 6.6.1.2 EEPROM Read
        3. 6.6.1.3 EEPROM Security
      2. 6.6.2 I2C Serial Interface
        1. 6.6.2.1 I2C Data Word
        2. 6.6.2.2 I2C Write Transaction
        3. 6.6.2.3 I2C Read Transaction
        4. 6.6.2.4 Examples of I2C Communication Protocol Packets
        5. 6.6.2.5 I2C Clock Stretching
        6. 6.6.2.6 CRC Byte Calculation
  8. 7 EEPROM (Non-Volatile) Register Map
    1. 7.1 Algorithm_Configuration Registers
    2. 7.2 Fault_Configuration Registers
    3. 7.3 Hardware_Configuration Registers
    4. 7.4 Internal_Algorithm_Configuration Registers
  9. 8 RAM (Volatile) Register Map
    1. 8.1 Fault_Status Registers
    2. 8.2 System_Status Registers
    3. 8.3 Algorithm_Control Registers
    4. 8.4 Device_Control Registers
    5. 8.5 Algorithm_Variables Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1.      Detailed Design Procedure
      2.      Bootstrap Capacitor and GVDD Capacitor Selection
      3.      Gate Drive Current
      4.      Gate Resistor Selection
      5.      System Considerations in High Power Designs
      6.      Capacitor Voltage Ratings
      7.      External Power Stage Components
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Bulk Capacitance
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Considerations
        1. 9.4.3.1 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

6.6.2.2 I2C Write Transaction

MCF8329HS-Q1 write transaction over I2C involves the following sequence (see Figure 6-52).

  1. I2C Start condition from the controller to initiate the transaction.
  2. Start is followed by the I2C target ID byte, made up of 7-bit target ID along with the R/W bit set to 0b. ACK in yellow box indicates that MCF8329HS-Q1 has processed the received target ID which has matched with it's I2C target ID and therefore will proceed with this transaction. If target ID received does not match with the I2C ID of MCF8329HS-Q1, then the transaction is ignored and no ACK is sent by MCF8329HS-Q1.
  3. The target ID byte is followed by the 24-bit control word sent one byte at a time. Bit 23 in the control word is 0b as it is a write transaction. ACK in blue boxes correspond to acknowledgements sent by MCF8329HS-Q1 to the controller that the previous byte (of control word) has been received and next byte can be sent.
  4. The 24-bit control word is then followed by the data bytes. The number of data bytes sent by the controller depends on the DLEN field in the control word.
    1. While sending data bytes, the LSB byte is sent first. Refer to Section 6.6.2.4 for more details.
    2. 16-bit/32-bit write – The data sent is written to the address mentioned in control word.
    3. 64-bit Write – 64-bit is treated as two successive 32-bit writes. The address mentioned in control word is taken as Addr_1. Addr_2 is internally calculated by MCF8329HS-Q1 by incrementing Addr_1 by 0x2. A total of 8 data bytes are sent. The first 4 bytes (sent in LSB first) are written to Addr_1 and the next 4 bytes are written to Addr_2.
    4. ACK in blue box (after every data byte) corresponds to the acknowledgement sent by MCF8329HS-Q1 to the controller that the previous data byte has been received and next data byte can be sent.
  5. If CRC is enabled, the packet ends with a CRC byte. CRC is calculated for the entire packet (Target ID + W bit, Control Word, Data Bytes). MCF8329HS-Q1 will send an ACK on receiving the CRC byte.
  6. I2C Stop condition from the controller to terminate the transaction.

MCF8329HS-Q1 I2C Write Transaction Sequence Figure 6-52 I2C Write Transaction Sequence