SLOS588G June   2008  – May 2025 TL4050A50-Q1 , TL4050B25-Q1 , TL4050B41-Q1 , TL4050B50-Q1 , TL4050C20-Q1 , TL4050C50-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings #GUID-CD5A394D-84DA-49EE-9F1D-C347D3339D1D/SLOS4567624
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 TL4050x20-Q1 Electrical Characteristics
    6. 5.6 TL4050x25-Q1 Electrical Characteristics
    7. 5.7 TL4050x41-Q1 Electrical Characteristics
    8. 5.8 TL4050x50-Q1 Electrical Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
  8. 7 Application Information
    1. 7.1 Output Capacitor
    2. 7.2 SOT-23-3 Pin Connections
    3. 7.3 Use With ADCs or DACs
    4. 7.4 Cathode and Load Currents
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8.5 Electrostatic Discharge Caution

TL4050-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.