SLOS654D August   2009  – December 2016 TPA3112D1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Characteristics, VCC = 24 V
    6. 6.6 DC Characteristics, VCC = 12 V
    7. 6.7 AC Characteristics, VCC = 24 V
    8. 6.8 AC Characteristics, VCC = 12 V
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Gain Setting Via Gain0 And Gain1 Inputs
      2. 7.3.2 SD Operation
      3. 7.3.3 PLIMIT
      4. 7.3.4 GVDD Supply
      5. 7.3.5 DC Detect
      6. 7.3.6 Short-Circuit Protection And Automatic Recovery Feature
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 TPA3112D1 Modulation Scheme
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Ferrite Bead Filter Considerations
        2. 8.2.2.2 Efficiency: LC Filter Required With the Traditional Class-D Modulation Scheme
        3. 8.2.2.3 When to Use an Output Filter for EMI Suppression
        4. 8.2.2.4 Input Resistance
        5. 8.2.2.5 Input Capacitor, CI
        6. 8.2.2.6 BSN and BSP Capacitors
        7. 8.2.2.7 Differential Inputs
        8. 8.2.2.8 Using Low-ESR Capacitors
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Recieving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage AVCC, PVCC –0.3 30 V
VI Interface pin voltage SD, FAULT,GAIN0, GAIN1, AVCC (Pin 14) –0.3 VCC + 0.3 V
< 10 V/ms
PLIMIT –0.3 GVDD + 0.3 V
INN, INP –0.3 6.3 V
TA Operating free-air temperature –40 85 °C
RL Minimum Load Resistance BTL 3.2 Ω
Tstg DMD storage temperature –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operations of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage PVCC, AVCC 8 26 V
VIH High-level input voltage SD, GAIN0, GAIN1 2 V
VIL Low-level input voltage SD, GAIN0, GAIN1 0.8 V
VOL Low-level output voltage FAULT, RPULLUP = 100 kΩ, VCC = 26 V 0.8 V
IIH High-level input current SD, GAIN0, GAIN1, VI = 2 V, VCC = 18 V 50 µA
IIL Low-level input current SD, GAIN0, GAIN1, VI = 0.8 V, VCC = 18 V 5 µA

6.4 Thermal Information

THERMAL METRIC(1) TPA3112D1 UNIT
PWP (HTSSOP)
28 PINS
RθJA Junction-to-ambient thermal resistance 30.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.5 °C/W
RθJB Junction-to-board thermal resistance 17.5 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 7.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 DC Characteristics, VCC = 24 V

TA = 25°C, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
| VOS | Class-D output offset voltage (measured differentially) VI = 0 V, Gain = 36 dB 1.5 15 mV
ICC Quiescent supply current SD = 2 V, no load, PVcc=21 V 40 mA
ICC(SD) Quiescent supply current in shutdown mode SD = 0.8 V, no load, PVcc=21 V 400 µA
rDS(on) Drain-source on-state resistance IO = 500 mA,
TJ = 25°C		 High side 240 mΩ
Low side 240
G Gain GAIN1 = 0.8 V GAIN0 = 0.8 V 19 20 21 dB
GAIN0 = 2 V 25 26 27
GAIN1 = 2 V GAIN0 = 0.8 V 31 32 33 dB
GAIN0 = 2 V 35 36 37
tON Turn-on time SD = 2 V 10 ms
tOFF Turn-off time SD = 0.8 V 2 μs
GVDD Gate Drive Supply IGVDD = 2 mA 6.5 6.9 7.3 V

6.6 DC Characteristics, VCC = 12 V

TA = 25°C, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
| VOS | Class-D output offset voltage (measured differentially) VI = 0 V, Gain = 36 dB 1.5 15 mV
ICC Quiescent supply current SD = 2 V, no load, PVcc=12 V 20 mA
ICC(SD) Quiescent supply current in shutdown mode SD = 0.8 V, no load, PVcc=12 V 200 µA
rDS(on) Drain-source on-state resistance IO = 500 mA,
TJ = 25°C		 High side 240 mΩ
Low side 240
G Gain GAIN1 = 0.8 V GAIN0 = 0.8 V 19 20 21 dB
GAIN0 = 2 V 25 26 27
GAIN1 = 2 V GAIN0 = 0.8 V 31 32 33 dB
GAIN0 = 2 V 35 36 37
tON Turn-on time SD = 2 V 10 ms
tOFF Turn-off time SD = 0.8 V 2 μs
GVDD Gate Drive Supply IGVDD = 2 mA 6.5 6.9 7.3 V
PLIMIT Output Voltage maximum under PLIMIT control VPLIMIT= 2.0 V; VI= 6.0-V differential 6.75 7.90 8.75 V

6.7 AC Characteristics, VCC = 24 V

TA = 25°C, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
KSVR Power Supply ripple rejection 200-mVPP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs AC-coupled to AGND		 –70 dB
PO Continuous output power THD+N ≤ 0.1%, f = 1 kHz, VCC = 24 V 25 W
THD+N Total harmonic distortion + noise VCC = 24 V, f = 1 kHz, PO = 12 W (half-power) <0.05%
Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB 65 µV
–80 dBV
Crosstalk VO = 1 Vrms, Gain = 20 dB, f = 1 kHz –70 dB
SNR Signal-to-noise ratio Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted		 102 dB
fOSC Oscillator frequency 250 310 350 kHz
Thermal trip point 150 °C
Thermal hysteresis 15 °C

6.8 AC Characteristics, VCC = 12 V

TA = 25°C, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
KSVR Supply ripple rejection 200-mVPP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND		 –70 dB
PO Continuous output power THD+N ≤ 10%, f = 1 kHz , RL = 8 Ω 10 W
PO Continuous output power THD+N ≤ 10%, f = 1 kHz , RL = 4 Ω 20 W
THD+N Total harmonic distortion + noise RL = 8 Ω, f = 1 kHz, PO = 5 W (half-power) <0.06%
Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB 65 µV
–80 dBV
Crosstalk Po = 1 W, Gain = 20 dB, f = 1 kHz –70 dB
SNR Signal-to-noise ratio Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted		 102 dB
fOSC Oscillator frequency 250 310 350 kHz
Thermal trip point 150 °C
Thermal hysteresis 15 °C

6.9 Typical Characteristics

(All Measurements taken at 1 kHz, unless otherwise noted. Measurements were made using the TPA3112D2 EVM which is available at ti.com.)
TPA3112D1 g001_los618.gif
Gain = 20 dB VCC = 12 V ZL = 8 Ω + 66 µH
Figure 1. Total Harmonic Distortion vs Frequency
TPA3112D1 g003_los618.gif
Gain = 20 dB VCC = 12 V ZL = 4 Ω + 33 µH
Figure 3. Total Harmonic Distortion vs Frequency
TPA3112D1 G005_LOS654.gif
Note: Dashed lines represent thermally limited region.
Gain = 20 dB VCC = 24 V ZL = 8 Ω + 66 µH
Figure 5. Total Harmonic Distortion + Noise vs Output Power
TPA3112D1 G007_LOS654.gif
Note: Dashed line represents thermally limited region.
Gain = 20 dB VCC = 24 V ZL = 8 Ω + 66 µH
Figure 7. Maximum Output Power vs Plimit Voltage
TPA3112D1 g009_los618.gif
Gain = 20 dB VCC = 12 V ZL = 8 Ω + 66 µH
CI = µF VI = 0.1 VRMS
Figure 9. Gain/Phase vs Frequency
TPA3112D1 G013_LOS654.gif
Note: Dashed line represents thermally limited region.
Gain = 20 dB ZL = 4 Ω + 33 µH
Figure 11. Efficiency vs Output Power
TPA3112D1 G015_LOS654.gif
Gain = 20 dB VCC = 12 V ZL = 4 Ω + 33 µH
Figure 13. Supply Current vs Total Output Power
TPA3112D1 g002_los618.gif
Gain = 20 dB VCC = 24 V ZL = 8 Ω + 66 µH
Figure 2. Total Harmonic Distortion vs Frequency
TPA3112D1 G004_LOS654.gif
Gain = 20 dB VCC = 12 V ZL = 8 Ω + 66 µH
Figure 4. Total Harmonic Distortion + Noise vs Output Power
TPA3112D1 G006_LOS654.gif
Gain = 20 dB VCC = 12 V ZL = 4 Ω + 33 µH
Figure 6. Total Harmonic Distortion + Noise vs Output Power
TPA3112D1 G008_LOS654.gif
Gain = 20 dB VCC = 12 V ZL = 4 Ω + 33 µH
Figure 8. Output Power vs Plimit Voltage
TPA3112D1 G012_LOS654.gif
Note: Dashed line represents thermally limited region.
Gain = 20 dB ZL = 8 Ω + 66 µH
Figure 10. Efficiency vs Output Power
TPA3112D1 G014_LOS654.gif
Note: Dashed line represents thermally limited region.
Gain = 20 dB ZL = 8 Ω + 66 µH
Figure 12. Supply Current vs Total Output Power
TPA3112D1 g016_los618.gif
Gain = 20 dB VCC = 12 V ZL = 8 Ω + 66 µH
Figure 14. Supply Ripple Rejection Ratio vs Frequency