SLOU584B September   2024  – July 2025

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
    1. 2.1 General Usage Information
  7. 3Hardware Design Files
    1. 3.1 Schematic
    2. 3.2 PCB Layout
      1. 3.2.1 Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1. 4.1 Trademarks
  9. 5Related Documentation
  10. 6Revision History

3.2 PCB Layout

Figure 3-2 through Figure 3-5 illustrate the PCB layers for this EVM.

TRF1305x1-D2D-EVM Top LayerFigure 3-2 Top Layer
TRF1305x1-D2D-EVM Layer 3Figure 3-4 Layer 3
TRF1305x1-D2D-EVM Layer 2Figure 3-3 Layer 2
TRF1305x1-D2D-EVM Bottom LayerFigure 3-5 Bottom Layer