SLOU587B February   2025  – May 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Additional Images
      1. 2.1.1 Pin Configuration
    2. 2.2 Power Requirements
    3. 2.3 Header Information
    4. 2.4 Jumper Information
    5. 2.5 Laser Diode
    6. 2.6 Snubber
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks
  10. 5Revision History

3.2 PCB Layouts

The following figures show the PCB layout for the LMH13000RQEEVM.

LMH13000RQEEVM LMH13000RQEEVM Top Layer Figure 3-2 LMH13000RQEEVM Top Layer
LMH13000RQEEVM LMH13000RQEEVM Second Layer (Ground Plane) Figure 3-3 LMH13000RQEEVM Second Layer (Ground Plane)
LMH13000RQEEVM LMH13000RQEEVM Third Layer (Power Plane) Figure 3-4 LMH13000RQEEVM Third Layer (Power Plane)
LMH13000RQEEVM LMH13000RQEEVM Bottom Layer Figure 3-5 LMH13000RQEEVM Bottom Layer