11 Revision History
Changes from Revision C (October 2015) to Revision D (July 2024)
- Changed document title to reflect the device's key features. Go
- Changed several specifications to reflect the device
characteristics.Go
- Removed 8-pin SOIC and 10-pin SON packages from the data sheet Go
- Changed Features section: 1) Changed junction temperature range
specification (From: -40°C to 140°C. To: -40°C to 150°C). 2) Deleted HBM and CDM
classification levels, no change in ratings in the ESD table. 3) Changed peak
currents to reflect specification, no change in actual drive strength (From:
4A/4A. To: 3.7A/4.5A). 4) Deleted 0.9-Ω Pullup and Pulldown Resistance since it
is not specified in the Electrical Characteristics. 5) Deleted Pseudo-CMOS
Compatible Input which is not a feature of UCC27211A device.Go
- Updated Applications section with list of top 5 typical
applications.Go
- Changed in Description section: 1) Added new D (SOIC, 8) package
variant. 2) Changed peak current to display typical pull-up/pull-down, no chang
in actual specification (From: 4A4/A. To: 3.7A/4.5A). 3) Deleted pullup/pulldown
resistance information since this is not an actual specification in the
electrical charactersitics table. 4) Updated propagation delay plot with new
data. 5) Changed HS transient tolerance to match the specification in the
Absolute Maximum table (From: -18V. To: -(24-VDD)V. Go
- Changed the VSON pinout view from top to bottom Go
- Updated Recommended Operating Conditions: Operating Junction
Temperature maximum changed from 140°C to 150°C.Go
- Updated Thermal Information section to reflect device
characteristics. Go
- Updated Supply Currents specifications in the Electrical
Characteristics table: 1) Minimum specification removed for IDD,
IDDO, IHB and IHBO. 2) IDD
typical changed (From: 0.085mA. To: 0.11mA). 3) IDDO typical changed
(From: 2.6mA. To: 1.4mA). 4) IDDO maximum changed (From: 6.5mA. To:
3mA. 5) IHBO typical changed (From: 2.5mA. To: 1.3mA). 6)
IHBO maximum changed (From: 5.1mA. To: 3mA). 8) IHBS
test condition changed to match VHS maximum recommended operating
conditions (From: 115V. To: 105V). 9) IHBSO typical changed (From:
0.07mA. To: 0.03mA). 10) IHBSO maximum changed (From: 1.2mA. To:
1mA). Go
- Updated Input specifications in the Electrical Characteristics
table: 1) VHIT minimum changed (From: 1.9V. To: 1.7V). 2)
VLIT minimum changed (From: 1.3V. To: 1.2V). Go
- Updated Bootstrap diode specifications in the Electrical
Characteristics table: 1) VF maximum changed (From: 0.8V. To: 0.85V).
2) VFI typical changed (From: 0.85V. To: 0.9V), and maximum changed
(From: 0.95V. To: 1.05V). 3) RD test conditions changed (From: 100mA
and 80mA. To: 180mA and 160mA). 4) RD typical changed (From: 0.5Ω.
To: 0.55Ω). Go
- Updated LO/HO Gate Driver specifications in the Electrical
Characteristics table: 1) Minimum specification removed for VLOL,
VLOH, VHOL, VHOH. 2) VLOL and
VHOL typical changed (From 0.1V. To 0.07V). 3) VLOH
and VHOH typical changed (From: 0.16V. To: 0.11V).Go
- Updated Switching Characteristics - Propagation Delays table: 1)
Changed TDLFF and TDHFF typicals (From: 16ns. To: 19ns). Go
- Updated Switching Characteristis - Output Rise and Fall Time table:
1) tR typical changed (From: 0.36us. To: 0.27us). 2) tF
typical changed (From: 0.15us. To: 0.16us). Go
- Updated Switching Characteristics - Miscellaneous table:
tIN_PW maximum changed (From: 50ns. To: 40ns).Go
- Updated all plots in Typical Characteristics section to reflect the
typical specification of the device. Go
- Changed typical specifications listed in the Overview section to
match the device specifications in the Electrical Characteristics
table.Go
- Changed Input Stages section to match the input pulldown resistance typical
specification in the electrical characteristics table (From: 70kΩ. To: 68kΩ). Go
- Changed application curves to display propagation delay and
rise/fall time plots. Go
Changes from Revision B (September 2013) to Revision C (October 2015)
- Added ESD Ratings table, Feature Description section,
Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section,
Device and Documentation Support section, and Mechanical,
Packaging, and Orderable Information section Go
- Changed PowerPAD to thermal pad throughout document Go
- Removed the UCC27210A device from the data sheetGo
Changes from Revision A (August 2013) to Revision B (September 2013)
- Changed marketing status from product preview to production
data.Go
Changes from Revision * (August 2013) to Revision A (August 2013)
- Added Note 2 to the Terminal Functions Table.Go