SLUSFG5A November   2024  – September 2025 UCC33421-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety Limiting Values
    8. 6.8  Electrical Characteristics
    9. 6.9  Insulation Characteristics Curves
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Disable
      2. 7.3.2 Output Voltage Soft-Start
      3. 7.3.3 Output Voltage Steady-State Regulation
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Input Under-Voltage and Over-Voltage Lockout
        2. 7.3.4.2 Output Under-Voltage Protection
        3. 7.3.4.3 Output Over-Voltage Protection
        4. 7.3.4.4 Over-Temperature Protection
        5. 7.3.4.5 Fault Reporting and Auto-Restart
      5. 7.3.5 VCC Load Recommended Operating Area
      6. 7.3.6 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical and Packaging Information

6.4 Thermal Information

THERMAL METRIC(1) UNIT
DHA SOIC
16 PINS
RθJA Junction-to-ambient thermal resistance 61.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 5.88 °C/W
RθJB Junction-to-board thermal resistance 22.2 °C/W
ΨJA Junction-to-ambient characterization parameter 59.6 °C/W
ΨJT Junction-to-top characterization parameter 5.8 °C/W
ΨJB Junction-to-board characterization parameter 23.6 °C/W
(1) The thermal resistances (R) are based on JEDEC board, and the characterization parameters (Ψ) are based on the EVM described in the Layout section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.