SLUSFK4A February   2025  – May 2025 UCC33020

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Power Ratings
    7. 6.7  Insulation Specifications
    8. 6.8  Safety-Related Certifications
    9. 6.9  Safety Limiting Values
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable and Disable
      2. 7.3.2 Output Voltage Soft-Start
      3. 7.3.3 Output Voltage Steady-State Regulation
      4. 7.3.4 Protection Features
        1. 7.3.4.1 Input Under-Voltage and Over-Voltage Lockout
        2. 7.3.4.2 Output Under-Voltage Protection
        3. 7.3.4.3 Output Over-Voltage Protection
        4. 7.3.4.4 Over-Temperature Protection
        5. 7.3.4.5 Fault Reporting and Auto-Restart
      5. 7.3.5 VCC Load Recommended Operating Area
      6. 7.3.6 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical and Packaging Information

6.4 Thermal Information

THERMAL METRIC(1) UNIT
VSON-FCRLF
12 PINS
RθJA Junction-to-ambient thermal resistance 59.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 7.35 °C/W
RθJB Junction-to-board thermal resistance 25.6 °C/W
ΨJA Junction-to-ambient characterization parameter 58.0 °C/W
ΨJT Junction-to-top characterization parameter 9.2 °C/W
ΨJB Junction-to-board characterization parameter 26.8 °C/W
(1) The thermal resistances (R) are based on JEDEC board, and the characterization parameters (Ψ) are based on the EVM described in the Layout section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.