SLUSFY4 December   2025 UCC21711-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delay
      1. 6.1.1 Regular Turn-OFF
    2. 6.2 Input Deglitch Filter
    3. 6.3 Active Miller Clamp
      1. 6.3.1 Internal On-chip Active Miller Clamp
    4. 6.4 Undervoltage Lockout (UVLO)
      1. 6.4.1 VCC UVLO
      2. 6.4.2 VDD UVLO
    5. 6.5 OC (Over Current) Protection
      1. 6.5.1 OC Protection with Soft Turn-OFF
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply
      2. 7.3.2  Driver Stage
      3. 7.3.3  VCC and VDD Undervoltage Lockout (UVLO)
      4. 7.3.4  Active Pulldown
      5. 7.3.5  Short Circuit Clamping
      6. 7.3.6  Internal Active Miller Clamp
      7. 7.3.7  Overcurrent and Short Circuit Protection
      8. 7.3.8  Soft Turn-off
      9. 7.3.9  Fault ( FLT, Reset and Enable ( RST/EN)
      10. 7.3.10 Isolated Analog to PWM Signal Function
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Filters for IN+, IN- and RST/EN
        2. 8.2.2.2 PWM Interlock of IN+ and IN-
        3. 8.2.2.3 FLT, RDY and RST/EN Pin Circuitry
        4. 8.2.2.4 RST/EN Pin Control
        5. 8.2.2.5 Turn-On and Turn-Off Gate Resistors
        6. 8.2.2.6 Overcurrent and Short Circuit Protection
          1. 8.2.2.6.1 Protection Based on Power Modules with Integrated SenseFET
          2. 8.2.2.6.2 Protection Based on Desaturation Circuit
          3. 8.2.2.6.3 Protection Based on Shunt Resistor in Power Loop
        7. 8.2.2.7 Isolated Analog Signal Sensing
          1. 8.2.2.7.1 Isolated Temperature Sensing
          2. 8.2.2.7.2 Isolated DC Bus Voltage Sensing
        8. 8.2.2.8 Higher Output Current Using an External Current Buffer
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

UCC21711-Q1 UCC21711-Q1DW SOIC (16)Top ViewFigure 4-1 UCC21711-Q1DW SOIC (16)Top View
Table 4-1 Pin Functions
PINI/O(1)DESCRIPTION
NAMENO.
AIN1IIsolated analog sensing input, parallel a small capacitor to COM for better noise immunity. Tie to COM if unused.
OC2IOver current detection pin, support lower threshold for SenseFET, DESAT, and shunt resistor sensing. Tie to COM if unused.
COM3PCommon ground reference, connecting to emitter pin for IGBT and source pin for SiC-MOSFET
OUTH4OGate driver output pull up
VDD5PPositive supply rail for gate drive voltage. Bypass with a >10-μF capacitor to COM to support specified gate driver source peak current capability. Place decoupling capacitor close to the pin.
OUTL6OGate driver output pull down
CLMPI7IInternal Active miller clamp, connecting this pin directly to the gate of the power transistor. Leave floating or tie to VEE if unused.
VEE8PNegative supply rail for gate drive voltage. Bypasswith a >10-μF capacitor to COM to support specified gate driver sink peak current capability. Place decoupling capacitor close to the pin.
GND9PInput power supply and logic ground reference
IN+10INon-inverting gate driver control input. Tie to VCC if unused.
IN–11IInverting gate driver control input. Tie to GND if unused.
RDY12OPower good for VCC-GND and VDD-COM. RDY is open drain configuration and can be paralleled with other RDY signals
FLT13OActive low fault alarm output upon over current or short circuit. FLT is in open drain configuration and can be paralleled with other faults
RST/EN14IThe RST/EN serves two purposes:
1) Enable / shutdown of the output side. The FET is turned off by a regular turn-off, if terminal EN is set to low;
2) Resets the DESAT condition signaled on FLT pin. if terminal RST/EN is set to low for more than 1000ns. A reset of signal FLT is asserted at the rising edge of terminal RST/EN.
For automatic RESET function, this pin only serves as an EN pin. Enable / shutdown of the output side. The FET is turned off by a general turn-off, if terminal EN is set to low.
VCC15PInput power supply from 3V to 5.5V. Bypass with a >1-μF capacitor to GND. Place decoupling capacitor close to the pin.
APWM16OIsolated Analog Sensing PWM output. Leave floating if unused.
(1) P = Power, G = Ground, I = Input, O = Output