SLUUD37 July   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Test Setup and Procedure
      1. 2.1.1 EVM Connections
      2. 2.1.2 Test Equipment
      3. 2.1.3 Recommended Test Setup
        1. 2.1.3.1 Input Connections
        2. 2.1.3.2 Output Connections
      4. 2.1.4 Test Procedure
        1. 2.1.4.1 Line and Load Regulation, Efficiency
  8. 3Implementation Results
    1. 3.1 Performance Data and Results
      1. 3.1.1 EVM Characteristics
      2. 3.1.2 Conversion Efficiency
      3. 3.1.3 Operating Waveforms
        1. 3.1.3.1 Start-Up and Shutdown with EN
        2. 3.1.3.2 Start-Up with VIN
        3. 3.1.3.3 Load Transient Response
        4. 3.1.3.4 Output Voltage Ripple
      4. 3.1.4 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
      1. 4.2.1 Multi-Layer Stackup
      2. 4.2.2 Component Drawings
    3. 4.3 Bill of Materials
  10. 5Compliance Information
    1. 5.1 Compliance and Certifications
  11. 6Additional Information
    1. 6.1 Trademarks
  12. 7Related Documentation

4.2 PCB Layout

Figure 5-2 through Figure 5-5 show the design of the TPS51375EVM using a four-layer PCB with 2-oz copper thickness.

TPS51375EVM Top Copper (Top View)Figure 4-2 Top Copper (Top View)
TPS51375EVM Layer 2 Copper (Top View)Figure 4-3 Layer 2 Copper (Top View)
TPS51375EVM Layer 3 Copper (Top View)Figure 4-4 Layer 3 Copper (Top View)
TPS51375EVM Bottom Copper (Top View)Figure 4-5 Bottom Copper (Top View)