SLUUD88B April   2025  – March 2026

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
    5. 1.5 Pin Configuration and Functions
  7. 2Hardware
    1. 2.1 EVM Setup and Operation
      1. 2.1.1 Recommended Test Equipment
      2. 2.1.2 External Connections for Easy Evaluation
        1. 2.1.2.1 Connecting Test Equipment
      3. 2.1.3 Powering the EVM
    2. 2.2 Test Points
    3. 2.3 Oscilloscope Probe Points
  8. 3Implementation Results
    1. 3.1 Performance Data
      1. 3.1.1 Efficiency Data
      2. 3.1.2 Regulation Data
      3. 3.1.3 Steady State Input Current
      4. 3.1.4 Start-up Waveforms
      5. 3.1.5 Output Ripple
      6. 3.1.6 Shutdown
      7. 3.1.7 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 Assembly and Printed Circuit Board (PCB) Layout
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Revision History

3.1.7 Thermal Performance

Full load EVM operation can result in very hot U1 package temperature. Use caution not to touch the U1 case when probing or handling the EVM during full load operation.

UCC34141EVM-116 Thermal Image: VIN=12V; IVDD-COM=72mA; ICOM-VEE=40mA Figure 3-16 Thermal Image: VIN=12V; IVDD-COM=72mA; ICOM-VEE=40mA
Equation 1. T RISE = 69 . 4 ° C - 21 . 4 ° C = 48 ° C