SLVAEH8A May   2020  – June 2021 TPS63000 , TPS63010 , TPS63020 , TPS63024 , TPS630250 , TPS63027 , TPS63030 , TPS63036 , TPS63050 , TPS63060 , TPS63070 , TPS63802 , TPS63805 , TPS63806 , TPS63810 , TPS63811

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Summary Table
  4. 3 Fundamentals of Switching Regulators
  5. 4 Design Support
  6. 5 PCB Layout and Thermal Considerations
  7. 6 EMI Considerations
  8. 7 Device-Specific Technical Discussions
  9. 8 Measurement Techniques
  10. 9 Buck-Boost Converter Applications
  11. 10Revision History

5 PCB Layout and Thermal Considerations

Printed circuit board (PCB) layout and thermal management are crucial for reliable operation of switching converters. This section lists application notes discussing PCB design guidelines and PCB and IC package thermal considerations.

QFN Layout Guidelines:SLOA122

Layout and stencil information for TI Quad Flat No-Lead (QFN) devices is provided in their data sheets. This document helps PCB designers to understand and better use this information for optimal designs.

PowerPAD™ Layout Guidelines:SLOA120

This application report focuses on helping PCB designers to understand and better use board layout and stencil information for Texas Instruments PowerPAD™ devices.

DSBGA Wafer Level Chip Scale Package:SNVA009

This application note provides information on handling, assembly, and usage of the die-sized ball grid array (DSBGA) wafer chip scale package (WCSP), common for many TI buck-boost devices.

Five Steps to a Great PCB Layout for a Step-Down Converter: SLYT614

Five Steps to a Good PCB Layout of a Boost Converter:SLVA773

A good PCB layout is critical for switching converters. These application notes present five simple steps to ensure that the converter’s PCB layout is robust and ready for prototyping. The reports refer to buck and boost converters, however the same principles are also valid for buck-boost converters.

Semiconductor and IC Package Thermal Metrics:SPRA953

Many thermal metrics for IC packages can be found in the device data sheets, such as RθJA or ΨJT. These thermal metrics are often misused when trying to use them to estimate junction temperatures in a system. This document describes traditional and new thermal metrics and puts their application in perspective with respect to system-level junction temperature estimation.