SLVAFU8 July   2024 TPSI2072-Q1 , TPSI2140-Q1 , TPSI3050 , TPSI3050-Q1 , TPSI3052 , TPSI3052-Q1 , TPSI3100 , TPSI3100-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2What Are Solid-State Relays?
    1. 2.1 History
      1. 2.1.1 Electromechanical Relays
      2. 2.1.2 Solid-State Relays
    2. 2.2 Isolation Technologies
      1. 2.2.1 Isolation Specifications
    3. 2.3 Relay Evolution
  6. 3Failure Mechanisms
    1. 3.1 Arcing in an Electromechanical Relay
    2. 3.2 Photo-degradation in Photo Relays
    3. 3.3 Partial Discharge
    4. 3.4 Time-Dependent Dielectric Breakdown in Capacitive and Inductive Isolation
  7. 4Electromechanical vs. Photo vs. Capacitive or Inductive
    1. 4.1 Electromechanical Relays
      1. 4.1.1 Advantages
        1. 4.1.1.1 No Leakage Current
      2. 4.1.2 Limitations
        1. 4.1.2.1 Switching Speed
        2. 4.1.2.2 Package Size
    2. 4.2 Photo or Optical Relays
      1. 4.2.1 Advantages
        1. 4.2.1.1 Lower EMI
      2. 4.2.2 Limitations
        1. 4.2.2.1 Limited Temperature Range
    3. 4.3 Capacitive or Inductive Based Relays
      1. 4.3.1 Advantages
        1. 4.3.1.1 Auxiliary Power
        2. 4.3.1.2 Bidirectional Communication
      2. 4.3.2 Limitations
        1. 4.3.2.1 EMI
    4. 4.4 Overall Comparison
  8. 5Summary
  9. 6References

4.4 Overall Comparison

Refer to Table 4-1 for comparisons among electromechanical relays, optical relays, and capacitive/inductive based relays.

Table 4-1 Performance Comparison
Type of Relay Device Power consumption at high temperature Package size Leakage current # of Switching cycles Reliability Switching speed
Non Solid-State Relay Electro-mechanical relays Higher Larger None Limited Lower Slow
Solid-State Relays Photo-based relays Higher Smaller Small leakage current High Better Quick
Capacitive/ Inductive based relays Lower Smaller Small leakage current High Better Quick