SLVS297R April   2000  – May 2026 LM317M , LM317MQ

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Both Legacy and New Chip)
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Input and Output Capacitor Requirements (Legacy Chip)
        2. 7.2.2.2  Input and Output Capacitor Requirements (New Chip)
        3. 7.2.2.3  Feedback Resistors
        4. 7.2.2.4  Adjustment Pin Capacitor
        5. 7.2.2.5  Protection Diodes
        6. 7.2.2.6  Overload Recovery
        7. 7.2.2.7  Estimating Junction Temperature
        8. 7.2.2.8  Polarity Reversal Protection
        9. 7.2.2.9  Reverse Current
        10. 7.2.2.10 Power Dissipation (PD)
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

8.1.2 Device Nomenclature

Table 8-1 Available Options
PRODUCT(1) DESCRIPTION
LM317MQyyyz
LM317MQDCYzM3Q1		 Q indicates that the device is a grade-1 device in accordance with the AEC-Q100 standard.
yyy is the package designator.
z is the package quantity.
Devices either ship with the legacy chip (CSO: SFB) or the new chip (CSO: RFB). The reel packaging label provides CSO information to distinguish which chip is used. Device performance for new and legacy chips is denoted throughout the document. M3 is a suffix designator only significant for the new chip with CSO:RFB, which uses the latest manufacturing flow
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.