SLVS350L October   2002  – January 2026 TPS795

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Shutdown
      2. 6.3.2 Start-Up
      3. 6.3.3 Undervoltage Lockout (UVLO)
      4. 6.3.4 Regulator Protection
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input and Output Capacitor Requirements
        2. 7.2.2.2 Load Transient Response
        3. 7.2.2.3 Output Noise
        4. 7.2.2.4 Dropout Voltage
        5. 7.2.2.5 Programming the TPS79501 Adjustable LDO Regulator
      3. 7.2.3 Application Curves
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Board Layout Recommendation to Improve PSRR and Noise Performance
        2. 7.5.1.2 Regulator Mounting
        3. 7.5.1.3 Thermal Considerations
        4. 7.5.1.4 Estimating Junction Temperature
      2. 7.5.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Modules
        2. 8.1.1.2 Spice Models
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC (1) TPS795 TPS795 UNIT
DRB (VSON) DCQ (SOT223-6)
8 PINS (2) 8 PINS (3) 6 PINS (2) 6 PINS (3)
RθJA Junction-to-ambient thermal resistance 46.8 54.7 74.0 71.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.1 76.1 44.5 41.6 °C/W
RθJB Junction-to-board thermal resistance 18.4 30.1 8.6 8.8 °C/W
ψJT Junction-to-top characterization parameter 0.7 6.6 3.2 3.5 °C/W
ψJB Junction-to-board characterization parameter 18.4 30.2 8.5 8.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.3 16.7 N/A 6 °C/W
(1) For more information about traditional and new thermal metrics, see the "Semiconductor and IC Package Thermal Metrics" application note.
(2) Legacy chip.
(3) New chip.