SLVSAW6J June   2011  – June 2026 LP2951-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Both Legacy and New Chip)
    6. 5.6 Timing Requirements (New Chip only)
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable
      2. 6.3.2 Dropout Voltage
      3. 6.3.3 Current Limit
      4. 6.3.4 Undervoltage Lockout (UVLO)
      5. 6.3.5 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Reverse Current
      2. 7.1.2 Input and Output Capacitor Requirements
      3. 7.1.3 Estimating Junction Temperature
      4. 7.1.4 Power Dissipation (PD)
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Recommended Capacitor Types
          1. 7.2.1.1.1 Recommended Capacitors (Legacy Chip)
            1. 7.2.1.1.1.1 ESR Range (Legacy Chip)
          2. 7.2.1.1.2 Recommended Capacitors (New Chip)
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Feedback Resistor Selection
        2. 7.2.2.2 Feedforward Capacitor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

9 Revision History

Changes from Revision I (November 2025) to Revision J (June 2026)

  • Updated output range for adjustable configurationGo
  • Updated the output range for adjustable configuration Go
  • Updated thermal information for DRG packageGo
  • Added Electrical limits for LP295X-XXADJ variant Go
  • Updated output range for Adjustable config and added details about VREF Go
  • Updated details about IFB current and updated equation about the VOUT voltage.Go
  • Updated details about FEEDBACK pin and VFB, voltage on FEEDBACK pin.Go
  • Added nomenclature details about LP2951xxADJ deviceGo

Changes from Revision H (November 2024) to Revision I (November 2025)

  • Updated tables for correct formatting throughout the documentGo
  • Updated legacy and new chip nomenclature throughout the documentGo
  • Updated Absolute Maximum continuous input voltage on Legacy chipGo
  • Changed Absolute Maximum output voltageGo
  • Changed Absolute Maximum SHUTDOWN input voltage on legacy chipGo
  • Changed Absolute Maximum output voltage sense on new chipGo
  • Added Absolute Maximum ratings for junction temperatureGo
  • Added note for maximum supported ESR range for new chipGo