SLVSB50C December 2011 – June 2020 TPS61087-Q1
PRODUCTION DATA.
| THERMAL METRIC(1) | TPS61087-Q1 | UNIT | ||
|---|---|---|---|---|
| DRC (VSON) | WDRC (VSON) | |||
| 10 PINS | 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 57 | 51.8 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 84.5 | 81.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 31.5 | 26.2 | °C/W |
| ψJT | Junction-to-top characterization parameter | 5.9 | 4.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 31.6 | 26.4 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 13 | 7.6 | °C/W |