SLVSBA2E July   2012  – July 2025 DRV8844

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Stage
      2. 6.3.2 Logic Inputs
      3. 6.3.3 Bridge Control
      4. 6.3.4 Charge Pump
      5. 6.3.5 Protection Circuits
        1. 6.3.5.1 Overcurrent Protection (OCP)
        2. 6.3.5.2 Thermal Shutdown (TSD)
        3. 6.3.5.3 Undervoltage Lockout (UVLO)
    4. 6.4 Device Functional Modes
      1. 6.4.1 nRESET and nSLEEP Operation
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Motor Voltage
      3. 7.2.3 Application Curves
    3.     Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
      3. 7.3.3 Thermal Considerations
        1. 7.3.3.1 Heatsinking
      4. 7.3.4 Power Dissipation
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Community Resources
    3. 8.3 Trademarks
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Electrical Characteristics

TA = 25°C, over operating free-air temperature range, all voltages relative to VNEG terminal (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
POWER SUPPLIES
IVMVM operating supply currentVM = 24 V, fPWM < 50 kHz15mA
IVMQVM sleep mode supply currentVM = 24 V500800μA
VUVLOVM undervoltage lockout voltageVM rising6.38V
V3P3OUT REGULATOR
V3P3V3P3OUT voltageIOUT = 0 to 1 mA3.183.33.52V
LOGIC-LEVEL INPUTS
VILInput low voltageLGND + 0.6LGND + 0.7V
VIHInput high voltageLGND + 2.2LGND + 5.25V
VHYSInput hysteresis50600mV
IILInput low currentVIN = LGND–55μA
IIHInput high currentVIN = LGND + 3.3 V100μA
RPDInternal pulldown resistance100
nFAULT OUTPUT (OPEN-DRAIN OUTPUT)
VOLOutput low voltageIO = 5 mALGND + 0.5V
IOHOutput high leakage currentVO = LGND + 3.3 V1μA
H-BRIDGE FETS
RDS(ON)HS FET on resistanceVM = 24 V, IO = 1 A, TJ = 25°C0.24
VM = 24 V, IO = 1 A, TJ = 85°C0.290.39
LS FET on resistanceVM = 24 V, IO = 1 A, TJ = 25°C0.24
VM = 24 V, IO = 1 A, TJ = 85°C0.290.39
IOFFOff-state leakage current–22μA
PROTECTION CIRCUITS
IOCPOvercurrent protection trip level3A
tDEADOutput dead time90ns
tOCPOvercurrent protection deglitch time5µs
TTSDThermal shutdown temperatureDie temperature150160180°C