SLVSBA2E July   2012  – July 2025 DRV8844

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Stage
      2. 6.3.2 Logic Inputs
      3. 6.3.3 Bridge Control
      4. 6.3.4 Charge Pump
      5. 6.3.5 Protection Circuits
        1. 6.3.5.1 Overcurrent Protection (OCP)
        2. 6.3.5.2 Thermal Shutdown (TSD)
        3. 6.3.5.3 Undervoltage Lockout (UVLO)
    4. 6.4 Device Functional Modes
      1. 6.4.1 nRESET and nSLEEP Operation
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Motor Voltage
      3. 7.2.3 Application Curves
    3.     Power Supply Recommendations
      1. 7.3.1 Bulk Capacitance
    4. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
      3. 7.3.3 Thermal Considerations
        1. 7.3.3.1 Heatsinking
      4. 7.3.4 Power Dissipation
  9. Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Community Resources
    3. 8.3 Trademarks
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VMPower supply voltage–0.365V
Logic ground voltage (LGND)–0.5VM - 8V
Digital pin voltageLGND – 0.5LGND + 7V
SRC12, SRC34 (pins 6 and 9 with optional sense resistor) to VNEG pins (pins 14 and 28)–0.60.6V
Peak motor drive output current, t < 1 μsInternally limitedA
Continuous motor drive output current(2)2.5A
TJOperating virtual junction temperature–40150°C
TstgStorage temperature–60150°C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Power dissipation and thermal limits must be observed.