SLVSCO0F June   2014  – July 2025 TPS22914 , TPS22915

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical DC Characteristics
    8. 6.8 Typical AC Characteristics (TPS22914B/15B)
    9. 6.9 Typical AC Characteristics (TPS22914C/15C)
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Input Capacitor (CIN)
      3. 8.3.3 Output Capacitor (CL)
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VIN to VOUT Voltage Drop
        2. 9.2.2.2 Inrush Current
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Thermal Considerations
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Related Links
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

TPS22914B TPS22914C TPS22915B TPS22915C YFP PACKAGE4 PIN DSBGATOP VIEWFigure 5-1 YFP PACKAGE4 PIN DSBGATOP VIEW
Table 5-1 Pin Description
BONGND
AVINVOUT
21
Table 5-2 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
A1 VOUT O Switch output. Place ceramic bypass capacitors between this pin and GND. See the Detailed Description section for more information
A2 VIN I Switch input. Place ceramic bypass capacitors between this pin and GND. See the Detailed Description section for more information
B1 GND — Device ground
B2 ON I Active high switch control input. Do not leave floating
(1) I = Input; O = Output.