SLVSH13A August   2024  – January 2025 TPSM83102

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Rating
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics 
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Adjustable Output Voltage
      4. 7.3.4 Reverse Current Operation
      5. 7.3.5 Protection Features
        1. 7.3.5.1 Input Overvoltage Protection
        2. 7.3.5.2 Short Circuit Protection
        3. 7.3.5.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Serial Interface Description
      2. 7.5.2 Standard-, Fast-, and Fast-Mode Plus Protocol
      3. 7.5.3 I2C Update Sequence
    6. 7.6 Register Map
      1. 7.6.1 Register Description
        1. 7.6.1.1 Register Map
        2. 7.6.1.2 Register CONTROL1 (Register address: 0x02; Default: 0x08)
        3. 7.6.1.3 Register VOUT (Register address: 0x03; Default: 0x5C)
        4. 7.6.1.4 Register CONTROL2 (Register address: 0x05; Default: 0x45)
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design with WEBENCH Tools
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Setting the Output Voltage
      3. 8.2.3 Application Curves
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design with WEBENCH Tools
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information
    2. 12.2 Mechanical Data

6.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC TPSM83102 TPSM83103 UNIT
uSiP-SIU
8
RΘJA Junction-to-ambient thermal resistance                       100 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance                       42.2 °C/W
RΘJB Junction-to-board thermal resistance                       33.2 °C/W
ΨJT Junction-to-top characterization parameter                       N/A °C/W
ΨJB Junction-to-board characterization parameter                       32.2 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance                       N/A °C/W