SLVSH26B April   2023  – December 2025 ESD441

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
      1. 7.1.1 Related Documentation
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

5.5 Thermal Information

THERMAL METRIC (1) ESD441 UNIT
DPL (DFN0603) DPY (DFN1006)
2 PINS 2 PINS
RθJA Junction-to-ambient thermal resistance 519.9 448.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 336.9 308.6 °C/W
RθJB Junction-to-board thermal resistance 209.2 197.5 °C/W
ΨJT Junction-to-top characterization parameter 136.7 159.4 °C/W
ΨJB Junction-to-board characterization parameter 207.2 196.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance NA NA °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.