SLVSHF3 October   2024 LP5899-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Oscillator and Clocks
        1. 7.3.1.1 System Clock
        2. 7.3.1.2 Continuous Clock Serial Interface (CCSI) Clock
      2. 7.3.2 Continuous Clock Serial Interface (CCSI)
        1. 7.3.2.1 Command Format
        2. 7.3.2.2 Command Recognition and Synchronization
        3. 7.3.2.3 CCSI Command Queue
        4. 7.3.2.4 CCSI Start Bit and Check Bits Insertion and Removal
      3. 7.3.3 FIFO
        1. 7.3.3.1 FIFO level and Data Ready (DRDY) Interrupt
        2. 7.3.3.2 FIFO Clearance
      4. 7.3.4 Diagnostics
        1. 7.3.4.1  Undervoltage Lockout
        2. 7.3.4.2  Oscillator Fault Diagnostics
        3. 7.3.4.3  SPI Communications Loss
        4. 7.3.4.4  SPI Communications Error
          1. 7.3.4.4.1 Reset Timer
          2. 7.3.4.4.2 Chip Select (CS) Reset
          3. 7.3.4.4.3 CRC Error
          4. 7.3.4.4.4 Register write failure
        5. 7.3.4.5  CCSI Communications Loss
          1. 7.3.4.5.1 SIN Stuck-at Diagnostics
        6. 7.3.4.6  CCSI Communications Error
          1. 7.3.4.6.1 CHECK Bit Error
          2. 7.3.4.6.2 Data Integrity Diagnostics
          3. 7.3.4.6.3 CCSI Command Queue Overflow
        7. 7.3.4.7  FIFO Diagnostics
          1. 7.3.4.7.1 TXFIFO Overflow
          2. 7.3.4.7.2 TXFIFO Underflow
          3. 7.3.4.7.3 TXFIFO Single Error Detection (SED)
          4. 7.3.4.7.4 RXFIFO Overflow
          5. 7.3.4.7.5 RXFIFO Underflow
          6. 7.3.4.7.6 RXFIFO Single Error Detection (SED)
        8. 7.3.4.8  OTP CRC Error
        9. 7.3.4.9  Fault Masking
        10. 7.3.4.10 Diagnostics Table
    4. 7.4 Device Functional Modes
      1. 7.4.1 Unpowered
      2. 7.4.2 Initialization State
      3. 7.4.3 Normal State
      4. 7.4.4 Failsafe State
    5. 7.5 Programming
      1. 7.5.1 SPI Data Validity
      2. 7.5.2 Chip Select (CS) and SPI Reset Control
      3. 7.5.3 SPI Command Format
      4. 7.5.4 SPI Command Detail
    6. 7.6 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage on pins VCC –0.3 6 V
SDI, SCLK, CS, SIN –0.3 VCC + 0.3 V
SDO, DRDY, SOUT, CLK_O –0.3 VCC + 0.3 V
FAULT –0.3 6 V
TJ Junction temperature –40 150 °C
Tstg Storage temperature –55 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.