SLVSHP8A January   2026  – June 2026 TPS544B28

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  D-CAP4 Control
      2. 7.3.2  Internal VCC LDO and Using External Bias On the VCC Pin
        1. 7.3.2.1 Powering the Device From a Single Bus
        2. 7.3.2.2 Powering the Device From a Split-Rail Configuration
      3. 7.3.3  Multifunction Select (MS1) Pin
      4. 7.3.4  Multifunction Select (MS2) Pin
      5. 7.3.5  PMBus® Address (ADR) Pin
      6. 7.3.6  Output Voltage Setting
        1. 7.3.6.1 Setting VBOOT and VOUT_SCALE_LOOP
        2. 7.3.6.2 Setting Output Voltage (Internal Feedback)
        3. 7.3.6.3 Setting Output Voltage (External Feedback)
      7. 7.3.7  Switching Frequency
      8. 7.3.8  Dynamic Voltage Slew Rate
      9. 7.3.9  Enable
      10. 7.3.10 Soft Start and Soft Stop
      11. 7.3.11 Power Good
      12. 7.3.12 Overvoltage and Undervoltage Protection
      13. 7.3.13 Remote Sense
      14. 7.3.14 Low-side MOSFET Zero-Crossing
      15. 7.3.15 Current Sense and Positive Overcurrent Protection
      16. 7.3.16 Low-side MOSFET Negative Current Limit
      17. 7.3.17 Output Voltage Discharge
      18. 7.3.18 UVLO Protection
      19. 7.3.19 Telemetry
      20. 7.3.20 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Auto-Skip (PFM) Eco-mode Light Load Operation
      2. 7.4.2 Forced Continuous-Conduction Mode
  9. 8 Programming Registers
    1. 8.1 Register Map
      1. 8.1.1  OPERATION (Address = 01h)
      2. 8.1.2  ON_OFF_CONFIG (Address = 02h)
      3. 8.1.3  CLEAR_FAULTS (Address = 03h)
      4. 8.1.4  WRITE_PROTECT (Address = 10h)
      5. 8.1.5  STORE_USER_ALL (Address = 15h)
      6. 8.1.6  RESTORE_USER_ALL (Address = 16h)
      7. 8.1.7  CAPABILITY (Address = 19h)
      8. 8.1.8  VOUT_MODE (Address = 20h)
      9. 8.1.9  VOUT_COMMAND (Address = 21h)
      10.      57
      11. 8.1.10 VOUT_MARGIN_HIGH (Address = 25h)
      12. 8.1.11 VOUT_MARGIN_LOW (Address = 26h)
      13. 8.1.12 VOUT_TRANSITION_RATE (Address = 27h)
      14. 8.1.13 61
      15. 8.1.14 VOUT_SCALE_LOOP (Address = 29h)
      16. 8.1.15 FREQUENCY_SWITCH (Address = 33h)
      17. 8.1.16 64
      18. 8.1.17 VOUT_OV_FAULT_RESPONSE (Address = 41h)
      19. 8.1.18 VOUT_UV_FAULT_RESPONSE (Address = 45h)
      20. 8.1.19 IOUT_OC_FAULT_LIMIT (Address = 46h)
      21.      68
      22. 8.1.20 TON_DELAY (Address = 60h)
      23. 8.1.21 TON_RISE (Address = 61h)
      24.      71
      25. 8.1.22 TOFF_DELAY (Address = 64h)
      26. 8.1.23 TOFF_FALL (Address = 65h)
      27. 8.1.24 STATUS_BYTE (Address = 78h)
      28. 8.1.25 STATUS_WORD (Address = 79h)
      29. 8.1.26 STATUS_CML (Address = 7Eh)
      30. 8.1.27 STATUS_MFR_SPECIFIC (Address = 80h)
      31. 8.1.28 READ_VOUT (Address = 8Bh)
      32. 8.1.29 READ_IOUT (Address = 8Ch)
      33. 8.1.30 READ_TEMP1 (Address = 8Dh)
      34. 8.1.31 PMBUS_REVISION (Address = 98h)
      35. 8.1.32 MFR_ID (Address = 99h)
      36. 8.1.33 MFR_MODEL (Address = 9Ah)
      37. 8.1.34 MFR_REVISION (Address = 9Bh)
      38. 8.1.35 IC_DEVICE_ID (Address = ADh)
      39. 8.1.36 IC_DEVICE_REV (Address = AEh)
      40. 8.1.37 SYS_CFG_USER1 (Address = D1h)
      41. 8.1.38 PASSKEY (Address = D2h)
      42. 8.1.39 COMP (Address = D4h)
      43.      90
      44. 8.1.40 VBOOT (Address = D5h)
      45.      92
      46. 8.1.41 NVM_CHECKSUM (Address = D9h)
      47. 8.1.42 FUSION_ID0 (Address = FCh)
      48. 8.1.43 FUSION_ID1 (Address = FDh)
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Voltage Setting Point
        2. 9.2.2.2 Choose the Switching Frequency
        3. 9.2.2.3 Choose the Inductor
        4. 9.2.2.4 Choose the Output Capacitor
        5. 9.2.2.5 Choose the Input Capacitors (CIN)
        6. 9.2.2.6 VCC Bypass Capacitor
        7. 9.2.2.7 BOOT Capacitor
        8. 9.2.2.8 PG Pullup Resistor
        9. 9.2.2.9 Choose the PMBus® Address and Fault Recovery Mode
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Performance On TI EVM
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

7.3.20 Thermal Shutdown

The device monitors internal junction temperature. If the temperature exceeds the threshold value (typically 165°C), the device stops switching. When the temperature falls approximately 15°C below the threshold value, the device turns back on with a re-initiated soft start. Thermal shutdown is a non-latch protection.

When an overtemperature fault condition occurs, the OTF bit in (78h) STATUS_BYTE is set and can be cleared with (03h) CLEAR_FAULTS.