SLVSI54A May 2025 – May 2026 TPS60800-Q1
PRODUCTION DATA
Solder all capacitors as close as possible to the IC. A PCB layout proposal for a dual-layer board is shown in Figure 8-10. Care has been taken to connect all capacitors as close as possible to the circuit to achieve optimized output voltage ripple performance. Please refer to the evaluation module user's guide in the product folder for more details on the layout.