SLVSI81 June   2025 MMBZ15VAL-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - AEC Specification
    3. 5.3 ESD Ratings - IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Receiving Notification of Documentation Updates
    3. 6.3 Support Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

5.5 Thermal Information

THERMAL METRIC (1) MMBZxxVAL-Q1 UNIT
DBZ ( SOT-23)
3 PINS
RθJA Junction-to-ambient thermal resistance 186.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 127.5 °C/W
RθJB Junction-to-board thermal resistance 74.1 °C/W
ΨJT Junction-to-top characterization parameter 46.7 °C/W
ΨJB Junction-to-board characterization parameter 73.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.