SLVSJ88 October   2026 TDZ8907

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter
      2. 7.3.2 PWM Level Shifter and Digital Logic
      3. 7.3.3 Differential Output Class-D Amplifier
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 PWM Input and Digital High Input
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application - PWM Input Mode
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout Guidelines
      1. 8.5.1 GND Connections
      2. 8.5.2 Power Connections
      3. 8.5.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information

8.5 Layout Guidelines

The small footprint of TDZ8907 and minimal required components allow for applications to use a 2 layer board design with most of the signals and power traces laid out on the same layer as the IC. Consider all the critical components to be placed close to the IC on the same layer. The following sections provide further guidance on each of the critical signals and component routings.