SLVSJ88 October   2026 TDZ8907

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Converter
      2. 7.3.2 PWM Level Shifter and Digital Logic
      3. 7.3.3 Differential Output Class-D Amplifier
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown
      2. 7.4.2 PWM Input and Digital High Input
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application - PWM Input Mode
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 What to Do and What Not to Do
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout Guidelines
      1. 8.5.1 GND Connections
      2. 8.5.2 Power Connections
      3. 8.5.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1.     PACKAGE OPTION ADDENDUM
    2. 11.1 Tape and Reel Information

8.5.1 GND Connections

  • The top and bottom layers are poured with GND at all places that no other signal is required.
  • Add via stitching to the GND planes from top to bottom layers for better thermal and electrical performance.
  • Add several vias to GND under the IC.
  • Add several vias to GND close to the decoupling capacitors, as well as close to GND pin 2.