SLVSJF0 October   2025 DRV7167

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information_DRV7167A
    5. 5.5 Electrical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Propagation Delay and Mismatch Measurement
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Inputs
      2. 7.3.2 Start-up and UVLO
      3. 7.3.3 Bootstrap Supply Regulation
      4. 7.3.4 Level Shift
      5. 7.3.5 Zero Voltage Detection (ZVD) Reporting
      6. 7.3.6 Short Circuit Protection (SCP)
      7. 7.3.7 Over Temperature Detection (OTD)
      8. 7.3.8 Fault Indication
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application - PWM Mode
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Examples
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Package Information
      1. 11.1.1 Mechanical Data

8.4.2 Layout Examples

Placements shown in Figure 8-3 and in the cross section of Figure 8-4 show the suggested placement of the device with respect to sensitive passive components, such as VM, bootstrap capacitors (HS and BOOT) and GVDD capacitors. Use appropriate spacing in the layout to reduce creepage and maintain clearance requirements in accordance with the application pollution level. Inner layers if present can be more closely spaced due to negligible pollution.

The layout must be designed to minimize the capacitance at the OUT node. Use as small an area of copper as possible to connect the device OUT pin to the inductor, or transformer, or other output load. Furthermore, ensure that the ground plane or any other copper plane has a cutout so that there is no overlap with the OUT node, as this would effectively form a capacitor on the printed circuit board. Additional capacitance on this node reduces the advantages of the advanced packaging approach of the DRV7167A and may result in reduced performance.

DRV7167 External Component Placement (Multi-layer PCB) Figure 8-3 External Component Placement (Multi-layer PCB)
DRV7167 Four-Layer Board Cross Section With Return Path Directly Underneath for Power Loop Figure 8-4 Four-Layer Board Cross Section With Return Path Directly Underneath for Power Loop