SLVSJI6 August   2025 SN74AC132

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4.   4
  5. Description
  6.   6
  7. Pin Configuration and Functions
  8. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Balanced CMOS Push-Pull Outputs
      2. 7.3.2 CMOS Schmitt-Trigger Inputs
      3. 7.3.3 Clamp Diode Structure
    4. 7.4 Device Functional Modes
  11. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
    3. 8.3 Design Requirements
      1. 8.3.1 Power Considerations
      2. 8.3.2 Input Considerations
      3. 8.3.3 Output Considerations
    4. 8.4 Detailed Design Procedure
    5. 8.5 Application Curves
    6. 8.6 Power Supply Recommendations
    7. 8.7 Layout
      1. 8.7.1 Layout Guidelines
      2. 8.7.2 Layout Example
  12. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  13. 10Revision History
  14. 11Mechanical, Packaging, and Orderable Information

Pin Configuration and Functions

SN74AC132 SN74AC132
            BQA Package
            (Top View)Figure 4-1 SN74AC132 BQA Package (Top View)
SN74AC132 SN74AC132,
              PW Package (Top View)Figure 4-2 SN74AC132, PW Package (Top View)
Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1A 1 I Channel 1, Input A
1B 2 I Channel 1, Input B
1Y 3 O Channel 1, Output Y
2A 4 I Channel 2, Input A
2B 5 I Channel 2, Input B
2Y 6 O Channel 2, Output Y
GND 7 G Ground
3Y 8 O Channel 3, Output Y
3A 9 I Channel 3, Input A
3B 10 I Channel 3, Input B
4Y 11 O Channel 4, Output Y
4A 12 I Channel 4, Input A
4B 13 I Channel 4, Input B
VCC 14 P Positive Supply
Thermal Pad(2) The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
Signal Types: I = Input, O = Output, G = Ground, P = Power.
BQA package only.