SLVU957A September   2019  – November 2021 BQ76922

 

  1.   Trademarks
  2. 1Features
    1. 1.1 Kit Contents
    2. 1.2 Ordering Information
    3. 1.3 BQ76922EVM Circuit Module Performance Specification Summary
    4. 1.4 Required Equipment
  3. 2BQ76922EVM Quick Start Guide
    1. 2.1 Before You Begin
    2. 2.2 Quick Start
  4. 3Interface Adapter
  5. 4Battery Management Studio Software
    1. 4.1 System Requirements
    2. 4.2 Installing BQStudio
    3. 4.3 BQ76922 bqz File Installation
    4. 4.4 BQStudio Operation and Registers View
    5. 4.5 Commands
    6. 4.6 Data Memory
      1. 4.6.1 Entering, Saving, and Loading Configuration
      2. 4.6.2 OTP Programming
    7. 4.7 Calibration
    8. 4.8 Command Sequences
  6. 5BQ76922EVM Circuit Module Use
    1. 5.1 Cell Simulator
    2. 5.2 Evaluating with Load Current
    3. 5.3 Evaluating Charge and Discharge Currents
    4. 5.4 Evaluating with Simulated Current
    5. 5.5 Reducing the Cell Count
    6. 5.6 Connecting Cells
    7. 5.7 Connecting to a Host
    8. 5.8 Hardware Configuration
      1. 5.8.1 Configuration Jumpers
      2. 5.8.2 Unused Components
    9. 5.9 Configuration Register Programming
  7. 6BQ76922EVM Circuit Module Physical Construction
    1. 6.1 Board Layout
    2. 6.2 Bill of Materials
    3. 6.3 REACH Compliance
    4. 6.4 Schematic
  8. 7Related Documents from Texas Instruments
  9. 8Revision History

Board Layout

The BQ76922EVM circuit module is a 3.0-inch × 4.9-inch 4-layer circuit card assembly. It is designed for easy assembly with cell connections on the left edge to a terminal block. Pack terminals are on the top edge using a terminal block. Wide trace areas are used reducing voltage drops on the high current paths. Optional connections for hardware feature pins are on a separate terminal block on the top edge of the board. An on-board interface adapter with USB connector is located in the right lower corner. Configuration headers are toward the right side of the board. Pushbutton switches for wake up and reset of the BQ76922 are located near the bottom edge of the board. The EVM layout and construction allows easy understanding of the connections and access to the test points for evaluation, but the connector area and programming features result in a large board.

The board layout includes spark gaps with the reference designator prefix E. These spark gaps are fabricated with the board and no component is installed.

See additional information in the configuration and operation sections of this document. Figure 6-1 to Figure 6-8 show the board layout.

GUID-20210730-SS0I-0HGQ-MLBV-P1DGVQRJNDJG-low.gif Figure 6-1 Top Silk Screen
GUID-20210730-SS0I-06KG-47QV-LSDKQBMDDNJZ-low.gif Figure 6-2 Top Assembly
GUID-20210730-SS0I-2FBP-GMZG-JVLBQQBDSFBK-low.gif Figure 6-3 Top Layer
GUID-20210730-SS0I-ZB1F-QKXN-FMSDSWGNT794-low.gif Figure 6-4 Layer 2
GUID-20210730-SS0I-LZ4V-GC3Q-8HFMVLVLG6TJ-low.gif Figure 6-5 Layer 3
GUID-20210730-SS0I-QFGT-B2MX-R82DPJNCD7BT-low.gif Figure 6-6 Bottom Layer
GUID-20210730-SS0I-G8X3-TL3H-DRLXRXVXV4GQ-low.gif Figure 6-7 Bottom Silk Screen
GUID-20210730-SS0I-21QV-MVPZ-PJXSKLC0S6HX-low.gif Figure 6-8 Bottom Assembly