SLVUC09 September   2021

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Background
    2. 1.2 Performance Specification
    3. 1.3 Modifications
      1. 1.3.1 IC U1 Operation
      2. 1.3.2 Device Enable Evaluation
  3. 2Setup
    1. 2.1 Input/Output Connector and Header Descriptions
    2. 2.2 Setup
  4. 3Board Layout
    1. 3.1 Layout
  5. 4Schematic and Bill of Materials
    1. 4.1 Schematic
    2. 4.2 Bill of Materials

1.3 Modifications

The printed-circuit board (PCB) for this EVM is designed to accommodate the TPS631000. Extra positions are available for additional input and output capacitors and a feedforward capacitor.