SLVUCF7 March   2022 TLVM13660

 

  1.   Trademarks
  2. 1High-Density EVM Description
    1. 1.1 Typical Applications
    2. 1.2 Features and Electrical Performance
  3. 2EVM Performance Specifications
  4. 3EVM Photo
  5. 4Test Setup and Procedure
    1. 4.1 EVM Connections
    2. 4.2 EVM Setup
    3. 4.3 Test Equipment
    4. 4.4 Recommended Test Setup
      1. 4.4.1 Input Connections
      2. 4.4.2 Output Connections
    5. 4.5 Test Procedure
      1. 4.5.1 Line/Load Regulation and Efficiency
  6. 5Test Data and Performance Curves
    1. 5.1 Efficiency and Load Regulation Performance
    2. 5.2 Waveforms
    3. 5.3 Bode Plot
    4. 5.4 Thermal Performance
    5. 5.5 EMI Performance
  7. 6EVM Documentation
    1. 6.1 Schematic
    2. 6.2 List of Materials
    3. 6.3 PCB Layout
    4. 6.4 Assembly Drawings
    5. 6.5 Multi-Layer Stackup
  8. 7Device and Documentation Support
    1. 7.1 Device Support
      1. 7.1.1 Development Support
        1. 7.1.1.1 Custom Design With WEBENCH® Tools
    2. 7.2 Documentation Support
      1. 7.2.1 Related Documentation

6.5 Multi-Layer Stackup

Table 6-2 Layer Stackup
Layer Number Layer Name Type Material Thickness (mil) Dielectric Material Dielectric Constant
Top Overlay Overlay
Top Solder Solder Mask/Coverlay Surface Material 0.4 Solder Resist 3.5
1 Top Layer Signal Copper 2.8
Dielectric1 Dielectric Core 5 FR-4 High Tg 4.8
2 Signal Layer 1 Signal Copper 2.8
Dielectric3 Dielectric None 40 FR-4 High Tg 4.8
3 Signal Layer 2 Signal Copper 2.8
Dielectric2 Dielectric None 5 FR-4 High Tg 4.8
4 Bottom Layer Signal Copper 2.8
Bottom Solder Solder Mask/Coverlay Surface Material 0.4 Solder Resist 3.5
Bottom Overlay Overlay