SLVUCX1 September   2024 TPS548B23

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Configurations and Modifications
      1. 2.1.1 Multifunction Configuration (CFG1-5) Pins Selection
      2. 2.1.2 Setting Output Voltage Using External Feedback Configuration
  9. 3Implementation Results
    1. 3.1 Test Setup and Results
      1. 3.1.1 Input and Output Connections
      2. 3.1.2 Efficiency
      3. 3.1.3 Output Voltage Regulation
      4. 3.1.4 Load Transient and Loop Response
      5. 3.1.5 Output Voltage Ripple
      6. 3.1.6 Start-up and Shutdown with EN
      7. 3.1.7 Thermal Performance
  10. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 Board Layout
      1. 4.2.1 Layout
    3. 4.3 Bill of Materials
  11. 5Additional Information
    1. 5.1 Trademarks

4.2.1 Layout

The board layout for the TPS548B23EVM is shown in Figure 4-2 and Figure 4-9. The top-side layer of the EVM is laid out in a manner typical of a user application. The top, bottom, and internal layers are 2-oz. copper.

TPS548B23EVM Top-Side Composite ViewFigure 4-2 Top-Side Composite View
TPS548B23EVM Top Layer LayoutFigure 4-4 Top Layer Layout
TPS548B23EVM Mid Layer 2 LayoutFigure 4-6 Mid Layer 2 Layout
TPS548B23EVM Mid Layer 4 LayoutFigure 4-8 Mid Layer 4 Layout
TPS548B23EVM Bottom-Side Composite View (Viewed From Bottom)Figure 4-3 Bottom-Side Composite View (Viewed From Bottom)
TPS548B23EVM Mid Layer 1 LayoutFigure 4-5 Mid Layer 1 Layout
TPS548B23EVM Mid Layer 3 LayoutFigure 4-7 Mid Layer 3 Layout
TPS548B23EVM Bottom Layer LayoutFigure 4-9 Bottom Layer Layout