SLVUCX4 October   2024

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 EVM Connections
    2. 2.2 Test Equipment
    3. 2.3 EVM Setup
      1. 2.3.1 Input Connections
      2. 2.3.2 Output Connections
      3. 2.3.3 Heat Sink Setup
  8. 3Implementation Results
    1. 3.1 Test Data and Performance Curves
      1. 3.1.1 Efficiency and Load Regulation Performance
      2. 3.1.2 Waveforms and Plots
      3. 3.1.3 EMI Performance
      4. 3.1.4 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematic
    2. 4.2 PCB Layout
    3. 4.3 Bill of Materials
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
        1. 6.1.1.1 Custom Design With WEBENCH® Tools
    2. 6.2 Documentation Support
      1. 6.2.1 Related Documentation

2.3.3 Heat Sink Setup

A heat sink is provided with this EVM. The heat sink reduces the temperature rise of the power converter. The thermal performance improvement can be examined and provide guidance to the thermal performance one can expect with a like-heat-sink in the end-application.

The heat sink can be mounted to the EVM after configuring the circuit to the particular application conditions. The heat sink has mounting holes on the EVM. To enable heat transfer, TI recommends to utilize thermally conductive tape between the IC and the heat sink. Make sure that the heat sink does not short out any of the passives the heat sink is hovering over. The thermal tape can also double as a insulator for quick evaluation. Use the best engineering judgment in setup.

There is no easy way to measure the device's junction temperature with a heatsink mounted. The user must rely on simulation to estimate the junction temperature for the end-application's heatsink and corresponding airflow. For reference, at 125°C oven temperature, with the provided heat sink mounted on the EVM, the device is capable (not going into thermal shutdown) of supporting a continuous load 1A higher than without. In this example, the thermal (convection) oven had an approximate airflow of 300-400 LFM.