SLVUE03 August   2026

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Power Requirements
    2. 2.2 Temperature Range
    3. 2.3 Energy Trace
    4. 2.4 Hardware and Debug Setup
      1. 2.4.1 Using a LaunchPad XDS110 Debug Probe
      2. 2.4.2 Using a Generic XDS110 Debug Probe, Including a Separate LaunchPad
    5. 2.5 BoosterPack Connector Pinout
    6. 2.6 XDS110 Interface Connector
    7. 2.7 Debug Interface Connector
    8. 2.8 Jumper Information
    9. 2.9 Push Buttons
  9. 3Advanced Use of the LaunchPad Hardware
    1. 3.1 External Antenna
    2. 3.2 XDS110 GPIOs and SWO
    3. 3.3 Reset Selection on BoosterPack Connector
    4. 3.4 I2C Pullup Resistors
  10. 4Software
    1. 4.1 Getting Started
    2. 4.2 Out of Box Demo
  11. 5Hardware Design Files
    1. 5.1 Reference Schematics
    2. 5.2 PCB Layouts
    3. 5.3 Bill of Materials (BOM)
  12. 6Compliance Information
    1. 6.1 CE Compliance
    2. 6.2 REACH Compliance
    3. 6.3 Waste Electrical and Electronic Equipment (WEEE) Compliance
  13. 7Additional Information
    1. 7.1 Trademarks
  14. 8References

2.8 Jumper Information

The LP-EM-CC2755P10 has two user-configurable jumpers as shown in Figure 2-1:

  • When the P2 LaunchPad jumper is connected across pins 1 and 2, this connects DIO16 to the onboard Red LED. When removed, this jumper allows direct connection of DIO16 to the BoosterPack header J4:36.
  • When the P2 LaunchPad jumper is connected across pins 2 and 4, this connects DIO12 to the onboard Green LED. When removed, this jumper allows direct connection of DIO12 to the BoosterPack header J2:19.

In addition the LP-EM-CC2755P10 has two additional jumpers that allow access to both 5V and GND through header P5 and 3.3V and GND through header P1 as show in Figure 2-1.