SNAS810B May   2020  – December 2025 LMK5B12204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: 4-Layer JEDEC Standard PCB
    5. 6.5 Thermal Information: 10-Layer Custom PCB
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Output Clock Test Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 ITU-T G.8262 (SyncE) Standards Compliance
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL Mode
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO_P/N)
      2. 8.3.2  Reference Inputs (PRIREF_P/N and SECREF_P/N)
        1. 8.3.2.1 Programmable Input Hysteresis
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Amplitude Monitor
          3. 8.3.7.2.3 Frequency Monitoring
          4. 8.3.7.2.4 Missing Pulse Monitor (Late Detect)
          5. 8.3.7.2.5 Runt Pulse Monitor (Early Detect)
          6. 8.3.7.2.6 1PPS Phase Validation Monitor
            1. 8.3.7.2.6.1 Check XO Input Frequency Accuracy for 1PPS Lock
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL1 XO Reference (R) Divider
          3. 8.3.8.3.3 APLL2 Reference (R) Dividers
        4. 8.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 8.3.8.5  APLL Feedback Divider Paths
          1. 8.3.8.5.1 APLL1N Divider With SDM
          2. 8.3.8.5.2 APLL2N Divider With SDM
        6. 8.3.8.6  APLL Loop Filters (LF1, LF2)
        7. 8.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2)
          1. 8.3.8.7.1 VCO Calibration
        8. 8.3.8.8  APLL VCO Clock Distribution Paths (P1, P2)
        9. 8.3.8.9  DPLL Reference (R) Divider Paths
        10. 8.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 8.3.8.11 DPLL Loop Filter (DLF)
        12. 8.3.8.12 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Channel Muxes
      11. 8.3.11 Output Dividers (OD)
      12. 8.3.12 Clock Outputs (OUTx_P/N)
        1. 8.3.12.1 AC-Differential Output (AC-DIFF)
        2. 8.3.12.2 HCSL Output
        3. 8.3.12.3 1.8V LVCMOS Output
        4. 8.3.12.4 Output Auto-Mute During LOL
      13. 8.3.13 Glitchless Output Clock Start-Up
      14. 8.3.14 Clock Output Interfacing and Termination
      15. 8.3.15 Output Synchronization (SYNC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Start-Up
        1. 8.4.1.1 Device Power-On Reset (POR)
        2. 8.4.1.2 PLL Start-Up Sequence
        3. 8.4.1.3 HW_SW_CTRL Pin Functionalities
        4. 8.4.1.4 Using the EEPROM
      2. 8.4.2 PLL Operating Modes
        1. 8.4.2.1 Free-Run Mode
        2. 8.4.2.2 Lock Acquisition
        3. 8.4.2.3 Locked Mode
        4. 8.4.2.4 Holdover Mode
      3. 8.4.3 Digitally-Controlled Oscillator (DCO) Mode
        1. 8.4.3.1 DCO Frequency Step Size
        2. 8.4.3.2 DCO Direct-Write Mode
    5. 8.5 Programming
      1. 8.5.1 Interface and Control
      2. 8.5.2 I2C Serial Communication
        1. 8.5.2.1 I2C Block Register Transfers
      3. 8.5.3 SPI Serial Communication
        1. 8.5.3.1 SPI Block Register Transfer
      4. 8.5.4 Register Map and EEPROM Map Generation
      5. 8.5.5 General Register Programming Sequence
      6. 8.5.6 EEPROM Programming Flow
        1. 8.5.6.1 EEPROM Programming Using Method #1 (Register Commit)
          1. 8.5.6.1.1 Write SRAM Using Register Commit
          2. 8.5.6.1.2 Program EEPROM
        2. 8.5.6.2 EEPROM Programming Using Method #2 (Direct Writes)
          1. 8.5.6.2.1 Write SRAM Using Direct Writes
          2. 8.5.6.2.2 User-Programmable Fields In EEPROM
      7. 8.5.7 Read SRAM
      8. 8.5.8 Read EEPROM
      9. 8.5.9 EEPROM Start-up Mode Default Configuration
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PDN) Pin
      3. 9.1.3 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.3.1 Mixing Supplies
        2. 9.1.3.2 Power-On Reset (POR) Circuit
        3. 9.1.3.3 Powering Up From a Single-Supply Rail
        4. 9.1.3.4 Power Up From Split-Supply Rails
        5. 9.1.3.5 Non-Monotonic or Slow Power-Up Supply Ramp
      4. 9.1.4 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
      2. 9.4.2 Device Current and Power Consumption
        1. 9.4.2.1 Current Consumption Calculations
        2. 9.4.2.2 Power Consumption Calculations
        3. 9.4.2.3 Example
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
        1. 9.5.3.1 Support for PCB Temperature up to 105°C
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 TICS Pro
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.4.1.3 HW_SW_CTRL Pin Functionalities

The LMK5B12204 can start up in one of three device modes depending on the 3-level input level sampled on the HW_SW_CTRL pin during power-on reset (POR), as shown in Table 8-11.

The start-up mode determines:

  • The memory bank (EEPROM or ROM) used to initialize the register settings that sets the frequency configuration at POR.
  • The serial interface (I2C or SPI) used for register access.
  • The logic pin functionality for device control and status.
The initial register settings from memory determine the frequency configuration of the device on start-up. After start-up, the device registers can be accessed through the serial interface for device monitoring and programming, and the logic pins function as defined by the selected mode.

Table 8-11 Start-Up Modes Based on HW_SW_CTRL Pin
HW_SW_CTRL

INPUT LEVEL(1)		START-UP MODEMODE DESCRIPTION
0EEPROM + I2C
(Soft pin mode)		Registers are initialized from the internal EEPROM, and I2C is enabled.
Logic pins:
  • SDA/SDI, SCL/SCK: I2C Data, I2C Clock (open-drain)
  • GPIO0/SYNCN: Output SYNC Input (active low). Pull up externally if not used.
  • GPIO1/SCS(1): I2C Address LSB Select (Low = 00b, Float = 01b, High = 10b)
  • GPIO2/SDO/FINC(2): DPLL DCO Frequency Increment (active high)
  • STATUS1/FDEC(2): DPLL DCO Frequency Decrement (active high), or Status output
Float
(VIM)		EEPROM + SPI
(Soft pin mode)		Registers are initialized from EEPROM, and SPI is enabled.
Logic pins:
  • SDA/SDI, SCL/SCK: SPI Data In (SDI), SPI Clock (SCK)
  • GPIO0/SYNCN: Output SYNC Input (active low). Pull up externally if not used.
  • GPIO1/SCS: SPI Chip Select (SCS)
  • GPIO2/SDO/FINC: SPI Data Out (SDO)
1

I2C + ROM

Registers are initialized from an internal ROM and I2C is enabled. The internal ROM contains unusable register settings. For normal operation, do not set the HW_CTRL_PIN = 1 to avoid loading from an unused internal ROM state. In the event of a rare CRC failure from an EEPROM boot-up, the device can boot-up from ROM to allow the user to reprogram the EEPROM through I2C.
Logic pins:
  • SDA/SDI, SCL/SCK: I2C Data, I2C Clock (open-drain)
  • GPIO[2:0](1): Set LOW (000b) by pulling to GND during POR
  • After POR, GPIO2/SDO/FINC and STATUS1/FDEC pins can function the same as for HW_SW_CTRL = 0.
(1) The input levels on these pins are sampled only during POR.
(2) FINC and FDEC pins are only available when DCO mode and GPIO pin control are enabled by registers.
Note:

To verify proper start-up into EEPROM + SPI Mode, the HW_SW_CTRL, STATUS0, and STATUS1 pins must all be floating or biased to VIM (0.8V typical) before the PDN pin is pulled high. These three pins momentarily operate as 3-level inputs and get sampled at the low-to-high transition of PDN to determine the device start-up mode during POR. If any of these pins are connected to a system host (MCU or FPGA), TI recommends using external biasing resistors on each pin (10kΩ pullup to 3.3V with 3.3kΩ pulldown to GND) to set the inputs to VIM during POR. After power up, the STATUS pins can operate as LVCMOS outputs to overdrive the external resistor bias for normal status operation.