SNAS810C May   2020  – May 2026 LMK5B12204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: 4-Layer JEDEC Standard PCB
    5. 6.5 Thermal Information: 10-Layer Custom PCB
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Output Clock Test Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 ITU-T G.8262 (SyncE) Standards Compliance
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL Mode
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO_P/N)
      2. 8.3.2  Reference Inputs (PRIREF_P/N and SECREF_P/N)
        1. 8.3.2.1 Programmable Input Hysteresis
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Amplitude Monitor
          3. 8.3.7.2.3 Frequency Monitoring
          4. 8.3.7.2.4 Missing Pulse Monitor (Late Detect)
          5. 8.3.7.2.5 Runt Pulse Monitor (Early Detect)
          6. 8.3.7.2.6 1PPS Phase Validation Monitor
            1. 8.3.7.2.6.1 Check XO Input Frequency Accuracy for 1PPS Lock
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL1 XO Reference (R) Divider
          3. 8.3.8.3.3 APLL2 Reference (R) Dividers
        4. 8.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 8.3.8.5  APLL Feedback Divider Paths
          1. 8.3.8.5.1 APLL1N Divider With SDM
          2. 8.3.8.5.2 APLL2N Divider With SDM
        6. 8.3.8.6  APLL Loop Filters (LF1, LF2)
        7. 8.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2)
          1. 8.3.8.7.1 VCO Calibration
        8. 8.3.8.8  APLL VCO Clock Distribution Paths (P1, P2)
        9. 8.3.8.9  DPLL Reference (R) Divider Paths
        10. 8.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 8.3.8.11 DPLL Loop Filter (DLF)
        12. 8.3.8.12 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Channel Muxes
      11. 8.3.11 Output Dividers (OD)
      12. 8.3.12 Clock Outputs (OUTx_P/N)
        1. 8.3.12.1 AC-Differential Output (AC-DIFF)
        2. 8.3.12.2 HCSL Output
        3. 8.3.12.3 1.8V LVCMOS Output
        4. 8.3.12.4 Output Auto-Mute During LOL
      13. 8.3.13 Glitchless Output Clock Start-Up
      14. 8.3.14 Clock Output Interfacing and Termination
      15. 8.3.15 Output Synchronization (SYNC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Start-Up
        1. 8.4.1.1 Device Power-On Reset (POR)
        2. 8.4.1.2 PLL Start-Up Sequence
        3. 8.4.1.3 HW_SW_CTRL Pin Functionalities
        4. 8.4.1.4 Using the EEPROM
      2. 8.4.2 PLL Operating Modes
        1. 8.4.2.1 Free-Run Mode
        2. 8.4.2.2 Lock Acquisition
        3. 8.4.2.3 Locked Mode
        4. 8.4.2.4 Holdover Mode
      3. 8.4.3 Digitally-Controlled Oscillator (DCO) Mode
        1. 8.4.3.1 DCO Frequency Step Size
        2. 8.4.3.2 DCO Direct-Write Mode
    5. 8.5 Programming
      1. 8.5.1 Interface and Control
      2. 8.5.2 I2C Serial Communication
        1. 8.5.2.1 I2C Block Register Transfers
      3. 8.5.3 SPI Serial Communication
        1. 8.5.3.1 SPI Block Register Transfer
      4. 8.5.4 Register Map and EEPROM Map Generation
      5. 8.5.5 General Register Programming Sequence
      6. 8.5.6 EEPROM Programming Flow
        1. 8.5.6.1 EEPROM Programming Using Method #1 (Register Commit)
          1. 8.5.6.1.1 Write SRAM Using Register Commit
          2. 8.5.6.1.2 Program EEPROM
        2. 8.5.6.2 EEPROM Programming Using Method #2 (Direct Writes)
          1. 8.5.6.2.1 Write SRAM Using Direct Writes
          2. 8.5.6.2.2 User-Programmable Fields In EEPROM
      7. 8.5.7 Read SRAM
      8. 8.5.8 Read EEPROM
      9. 8.5.9 EEPROM Start-up Mode Default Configuration
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PDN) Pin
      3. 9.1.3 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.3.1 Mixing Supplies
        2. 9.1.3.2 Power-On Reset (POR) Circuit
        3. 9.1.3.3 Powering Up From a Single-Supply Rail
        4. 9.1.3.4 Power Up From Split-Supply Rails
        5. 9.1.3.5 Non-Monotonic or Slow Power-Up Supply Ramp
      4. 9.1.4 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
      2. 9.4.2 Device Current and Power Consumption
        1. 9.4.2.1 Current Consumption Calculations
        2. 9.4.2.2 Power Consumption Calculations
        3. 9.4.2.3 Example
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
        1. 9.5.3.1 Support for PCB Temperature up to 105°C
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 TICS Pro
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
    2. 12.2 Tape and Reel Information

3 Description

The LMK5B12204 is high-performance network synchronizer and jitter cleaner designed to meet the stringent requirements of Ethernet-based networking applications.

The device integrates one DPLL and two APLLs to provide hitless switching and jitter attenuation using the programmable loop bandwidths (LBWs) with one external loop filter capacitor to maximize the flexibility and ease of use.

APLL1 features an ultra-high performance PLL with TI's proprietary Bulk Acoustic Wave (BAW) technology in VCO1 and can generate 312.5MHz output clocks with 50fs typical RMS jitter (12kHz to 20MHz) irrespective of the DPLL reference input frequency and jitter characteristics. APLL2 features a conventional LC VCO to provide options for a second frequency and/or synchronization domain.

The integrated EEPROM can be used for custom system configurations on start-up. Internal LDO regulators provide excellent power supply noise rejection (PSNR) to reduce the cost and complexity of the power delivery network.

Package Information
PART NUMBER PACKAGE(1) PACKAGE SIZE(2)
LMK5B12204 RGZ (VQFN, 48) 7mm × 7mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
LMK5B12204 Typical System Block DiagramTypical System Block Diagram