SNAS810C May   2020  – May 2026 LMK5B12204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: 4-Layer JEDEC Standard PCB
    5. 6.5 Thermal Information: 10-Layer Custom PCB
    6. 6.6 Electrical Characteristics
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Output Clock Test Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 ITU-T G.8262 (SyncE) Standards Compliance
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL Mode
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO_P/N)
      2. 8.3.2  Reference Inputs (PRIREF_P/N and SECREF_P/N)
        1. 8.3.2.1 Programmable Input Hysteresis
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Amplitude Monitor
          3. 8.3.7.2.3 Frequency Monitoring
          4. 8.3.7.2.4 Missing Pulse Monitor (Late Detect)
          5. 8.3.7.2.5 Runt Pulse Monitor (Early Detect)
          6. 8.3.7.2.6 1PPS Phase Validation Monitor
            1. 8.3.7.2.6.1 Check XO Input Frequency Accuracy for 1PPS Lock
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL1 XO Reference (R) Divider
          3. 8.3.8.3.3 APLL2 Reference (R) Dividers
        4. 8.3.8.4  APLL Phase Frequency Detector (PFD) and Charge Pump
        5. 8.3.8.5  APLL Feedback Divider Paths
          1. 8.3.8.5.1 APLL1N Divider With SDM
          2. 8.3.8.5.2 APLL2N Divider With SDM
        6. 8.3.8.6  APLL Loop Filters (LF1, LF2)
        7. 8.3.8.7  APLL Voltage Controlled Oscillators (VCO1, VCO2)
          1. 8.3.8.7.1 VCO Calibration
        8. 8.3.8.8  APLL VCO Clock Distribution Paths (P1, P2)
        9. 8.3.8.9  DPLL Reference (R) Divider Paths
        10. 8.3.8.10 DPLL Time-to-Digital Converter (TDC)
        11. 8.3.8.11 DPLL Loop Filter (DLF)
        12. 8.3.8.12 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Channel Muxes
      11. 8.3.11 Output Dividers (OD)
      12. 8.3.12 Clock Outputs (OUTx_P/N)
        1. 8.3.12.1 AC-Differential Output (AC-DIFF)
        2. 8.3.12.2 HCSL Output
        3. 8.3.12.3 1.8V LVCMOS Output
        4. 8.3.12.4 Output Auto-Mute During LOL
      13. 8.3.13 Glitchless Output Clock Start-Up
      14. 8.3.14 Clock Output Interfacing and Termination
      15. 8.3.15 Output Synchronization (SYNC)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Start-Up
        1. 8.4.1.1 Device Power-On Reset (POR)
        2. 8.4.1.2 PLL Start-Up Sequence
        3. 8.4.1.3 HW_SW_CTRL Pin Functionalities
        4. 8.4.1.4 Using the EEPROM
      2. 8.4.2 PLL Operating Modes
        1. 8.4.2.1 Free-Run Mode
        2. 8.4.2.2 Lock Acquisition
        3. 8.4.2.3 Locked Mode
        4. 8.4.2.4 Holdover Mode
      3. 8.4.3 Digitally-Controlled Oscillator (DCO) Mode
        1. 8.4.3.1 DCO Frequency Step Size
        2. 8.4.3.2 DCO Direct-Write Mode
    5. 8.5 Programming
      1. 8.5.1 Interface and Control
      2. 8.5.2 I2C Serial Communication
        1. 8.5.2.1 I2C Block Register Transfers
      3. 8.5.3 SPI Serial Communication
        1. 8.5.3.1 SPI Block Register Transfer
      4. 8.5.4 Register Map and EEPROM Map Generation
      5. 8.5.5 General Register Programming Sequence
      6. 8.5.6 EEPROM Programming Flow
        1. 8.5.6.1 EEPROM Programming Using Method #1 (Register Commit)
          1. 8.5.6.1.1 Write SRAM Using Register Commit
          2. 8.5.6.1.2 Program EEPROM
        2. 8.5.6.2 EEPROM Programming Using Method #2 (Direct Writes)
          1. 8.5.6.2.1 Write SRAM Using Direct Writes
          2. 8.5.6.2.2 User-Programmable Fields In EEPROM
      7. 8.5.7 Read SRAM
      8. 8.5.8 Read EEPROM
      9. 8.5.9 EEPROM Start-up Mode Default Configuration
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PDN) Pin
      3. 9.1.3 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.3.1 Mixing Supplies
        2. 9.1.3.2 Power-On Reset (POR) Circuit
        3. 9.1.3.3 Powering Up From a Single-Supply Rail
        4. 9.1.3.4 Power Up From Split-Supply Rails
        5. 9.1.3.5 Non-Monotonic or Slow Power-Up Supply Ramp
      4. 9.1.4 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
      2. 9.4.2 Device Current and Power Consumption
        1. 9.4.2.1 Current Consumption Calculations
        2. 9.4.2.2 Power Consumption Calculations
        3. 9.4.2.3 Example
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
        1. 9.5.3.1 Support for PCB Temperature up to 105°C
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 TICS Pro
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information
    2. 12.2 Tape and Reel Information

8.3.7.2 Reference Input Monitoring

Each DPLL reference clock input is independently monitored for input validation before the reference clock is qualified and available for selection by the DPLL. The reference monitoring blocks include the amplitude, frequency threshold, missing pulse (late window), runt pulse (early window), and 1PPS phase valid detectors. For input frequencies less than 2kHz, the 1PPS phase valid and LVCMOS amplitude detectors are supported, while the differential input amplitude, frequency threshold, missing pulse, and runt pulse monitors are not supported and must be disabled. For input frequencies greater than or equal to 2kHz, all detectors excepts the 1PPS phase valid monitor are supported. A validation timer is also available to set the minimum time for all enabled reference monitors to be clear of flags before an input is qualified.

The enablement and valid threshold for all reference monitors and validation timers are programmable per input. The reference monitors and validation timers are optional to enable, but are critical to achieve reliable DPLL lock and optimal transient performance during holdover or switchover events. The reference monitors and validation timers are also used to avoid selection of an unreliable or intermittent clock input. If a given detector is not enabled, the detector does not set a flag and is ignored. The status flag of any enabled detector can be observed through the status pins for any reference input (selected or not selected). The status flags of the enabled detectors can also be read through the status bits for the selected input of the DPLL.