over operating free-air temperature range (unless otherwise noted)(1)(2) | MIN | MAX | UNIT |
|---|
| Reverse current | | 20 | mA |
| Forward current | | 10 | mA |
| Power dissipation (TA = 25°C)(3) | SOT-23 (M3) package | | 306 | mW |
| TO-92 (Z) package | | 550 | mW |
| SC70 (M7) package | | 241 | mW |
| Storage temperature, Tstg | –65 | 150 | °C |
(1) Stresses beyond those listed under
Absolute Maximum Ratings can cause
permanent damage to the device. These are stress ratings only, which do not imply
functional operation of the device at these or any other conditions beyond those indicated
under
Section 5.3. Exposure to absolute-maximum-rated conditions for extended periods can affect
device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature), RθJA (junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is PDmax = (TJmax − TA)/RθJA or the number given in the Absolute Maximum Ratings, whichever is lower. For the LM4040-N, TJmax = 125°C, and the typical thermal resistance (RθJA), when board mounted, is 326°C/W for the SOT-23 package, and 180°C/W with 0.4″ lead length and 170°C/W with 0.125″ lead length for the TO-92 package and 415°C/W for the SC70 Package.