SNOSDK2B June   2024  – June 2025 TLV3231-Q1 , TLV3232-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Configurations: TLV3231 and TLV3232
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information, TLV3231
    5. 5.5 Thermal Information, TLV3232
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Inputs
      2. 6.4.2 Internal Hysteresis
      3. 6.4.3 Outputs
      4. 6.4.4 ESD Protection
      5. 6.4.5 Power-On Reset (POR) - Dual Channel Only
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
      2. 7.1.2 Hysteresis
        1. 7.1.2.1 Inverting Comparator With Hysteresis
        2. 7.1.2.2 Non-Inverting Comparator With Hysteresis
    2. 7.2 Typical Applications
      1. 7.2.1 Low-Side Current Sensing
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.5 Thermal Information, TLV3232

THERMAL METRIC (1) TLV3232 UNIT
DGK (VSSOP) DSG (WSON)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 154.5 78.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 88.8 99.9 °C/W
RθJB Junction-to-board thermal resistance 49.1 44.4 °C/W
ΨJT Junction-to-top characterization parameter 1.8 5 °C/W
ΨJB Junction-to-board characterization parameter 87.4 44.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 19.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.