SNVS018AB
March 2000 – June 2025
LP2985-N
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagrams
6.3
Feature Description
6.3.1
Output Enable
6.3.2
Dropout Voltage
6.3.3
Current Limit
6.3.4
Undervoltage Lockout (UVLO)
6.3.5
Output Pulldown
6.3.6
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
Normal Operation
6.4.2
Dropout Operation
6.4.3
Disabled
7
Application and Implementation
7.1
Application Information
7.1.1
Recommended Capacitor Types
7.1.1.1
Recommended Capacitors (Legacy Chip)
7.1.1.2
Recommended Capacitors (New Chip)
7.1.2
Input Capacitor Requirements
7.1.3
Output Capacitor Requirements
7.1.4
Noise Bypass Capacitor (CBYPASS)
7.1.5
Reverse Current
7.1.6
Power Dissipation (PD)
7.1.7
Estimating Junction Temperature
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
ON/OFF Input Operation
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Documentation Support
8.1.1
Related Documentation
8.2
Device Nomenclature
8.3
Receiving Notification of Documentation Updates
8.4
Support Resources
8.5
Trademarks
8.6
Electrostatic Discharge Caution
8.7
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
8.1.1
Related Documentation
Texas Instruments,
Semiconductor and IC Package Thermal Metrics
application note
Texas Instruments,
Using New Thermal Metrics
application note
Texas Instruments,
Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs
application note